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TRSF3222EIDBRG4

Texas Instruments

TRSF3222EIDBRG4 by Texas Instruments

TRSF3222EIDBRG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It has a small outline package style, Schmitt trigger input characteristics, and supports EIA-232-F interface standard. Ideal for industrial applications requiring reliable data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,101 parts In-Stock

1+ parts

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9,101

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Digiode

USA . 856 parts In-Stock

1+ parts

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856

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 618 parts In-Stock

1+ parts

$9.381

100+ parts

-

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618

$9.381

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Parana Technologies

USA . 889 parts In-Stock

1+ parts

$10.532

100+ parts

-

1k+ parts

$11.040

10k+ parts

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889

$10.532

-

$11.040

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ChromeModa Solutions

Germany . 1,569 parts In-Stock

1+ parts

$11.834

100+ parts

$9.704

1k+ parts

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10k+ parts

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1,569

$11.834

$9.704

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IDEA Electronic Components Group

UK . 642 parts In-Stock

1+ parts

$11.834

100+ parts

$11.242

1k+ parts

$10.651

10k+ parts

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642

$11.834

$11.242

$10.651

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One Stop Electronics

USA . 1,099 parts In-Stock

1+ parts

$47.500

100+ parts

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1,099

$47.500

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QUARKTWIN TECHNOLOGY LTD

USA . 21,402 parts In-Stock

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21,402

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Microchip USA

USA . 4,426 parts In-Stock

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4,426

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Corphita

USA . 3,397 parts In-Stock

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3,397

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DigiPath Technology Company

USA . 1,848 parts In-Stock

1+ parts

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100+ parts

$10.670

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1,848

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$10.670

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Overview

Experience unparalleled quality and reliability with the TRSF3222EIDBRG4 by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Line Driver & Receiver, this product offers seamless integration and superior performance for a wide range of applications. With a compact design and advanced features, customers can expect exceptional value and benefits, including high-speed data transmission, low power consumption, and industrial-grade durability. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the components inside, making this product reliable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product is compatible with a wide range of power sources, providing versatility in usage.

No. of Functions: 2

Having 2 functions in one package offers cost savings and space efficiency in circuit design and implementation.

Package Shape: RECTANGULAR

The rectangular package shape simplifies the design and layout of the circuit board, making it easier to integrate this product into various applications.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages of 3.3V and 5V, this product can be used in a variety of systems with different voltage requirements.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and flexibility in interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the circuit board, making it ideal for compact electronic devices.

Maximum High Level Input Current: 0.000001 Amp

The low high-level input current requirement minimizes power consumption and reduces heat generation in the circuit.

Minimum Supply Voltage: 3 V

Supporting a minimum supply voltage of 3V ensures compatibility with a wide range of power sources, providing stable operation in various environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance in harsh operating conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability in various environments.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit board layout and connections, making installation and maintenance easier.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm saves space on the circuit board and accommodates compact designs.

Width: 5.3 mm

The narrow width of 5.3mm allows for compact installation and integration into tight spaces or small electronic devices.

Maximum Output Low Current: 1.6 Amp

The high maximum output low current capability of 1.6A ensures reliable signal transmission and robust performance in demanding applications.

Receiver No. of Bits: 2

Having 2 bits for the receiver allows for binary data transmission, making this product suitable for digital communication applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during manufacturing and assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring secure and durable connections.

Length: 7.2 mm

The length of 7.2mm provides a compact footprint for space-constrained applications, facilitating easy integration into electronic systems.

Minimum Out Swing: 10 V

The minimum output swing of 10V ensures reliable signal transmission and compatibility with a wide range of systems and devices.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is designed to operate reliably in harsh industrial environments with extended temperature ranges.

Maximum Receive Delay: 0 ns

The zero receive delay ensures real-time signal transmission and minimal latency, making this product suitable for high-speed communication applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical attachment and easy soldering onto the circuit board, ensuring reliable connections and easy assembly.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Supporting multiple interface standards including EIA-232-F, TIA-232-F, and V.28, this product offers versatility and compatibility with a variety of communication protocols.

Maximum Supply Current: 1 mA

With a maximum supply current of 1mA, this product consumes low power, making it energy-efficient and suitable for battery-powered devices.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics ensure reliable signal processing and noise immunity, making this product ideal for applications with varying input signal levels.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable operation and compatibility with standard power sources, making this product easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm allows for high-density mounting on the circuit board, saving space and enabling compact designs.

Driver No. of Bits: 2

With 2 bits for the driver, this product supports binary data transmission and accurate signal processing, making it suitable for digital communication applications.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product can transmit and receive signals over communication lines, making it essential for interfacing between different systems and devices.

Technical Specifications

Line Drivers & Receivers TRSF3222EIDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TRSF3222EIDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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