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TRSF3222CDW

Texas Instruments

TRSF3222CDW by Texas Instruments

TRSF3222CDW by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 20 terminals, and EIA-232 interface standard. It operates in commercial temperature grade from 0 to 70 °C and has dual terminal position for versatile applications requiring high-speed data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,051 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,051

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Vyrian

USA . 2,980 parts In-Stock

1+ parts

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100+ parts

-

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2,980

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,033 parts In-Stock

1+ parts

$1.845

100+ parts

-

1k+ parts

$2.393

10k+ parts

-

2,033

$1.845

-

$2.393

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DigiPath Technology Company

USA . 357 parts In-Stock

1+ parts

$2.032

100+ parts

$1.869

1k+ parts

-

10k+ parts

-

357

$2.032

$1.869

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-

ChromeModa Solutions

Germany . 6,243 parts In-Stock

1+ parts

$2.073

100+ parts

$1.700

1k+ parts

-

10k+ parts

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6,243

$2.073

$1.700

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IDEA Electronic Components Group

UK . 912 parts In-Stock

1+ parts

$2.073

100+ parts

-

1k+ parts

$1.866

10k+ parts

-

912

$2.073

-

$1.866

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One Stop Electronics

USA . 1,326 parts In-Stock

1+ parts

$17.500

100+ parts

-

1k+ parts

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10k+ parts

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1,326

$17.500

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$18.989

100+ parts

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1k+ parts

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10k+ parts

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786

$18.989

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Component Stockers USA

USA . 352 parts In-Stock

1+ parts

$99.990

100+ parts

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352

$99.990

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Microchip USA

USA . 472 parts In-Stock

1+ parts

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472

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Corphita

USA . 72 parts In-Stock

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72

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Overview

Elevate your electronic projects with the TRSF3222CDW from Texas Instruments, a top-tier manufacturer known for producing high-quality line drivers & receivers. Perfect for a wide range of applications, this versatile component offers unparalleled value and benefits to customers. Experience seamless connectivity, reliable performance, and enhanced functionality with this advanced product. Upgrade your projects today with the TRSF3222CDW and unlock a new world of possibilities in the realm of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

No. of Functions: 2

Having multiple functions in one package increases efficiency and reduces the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, making it easier to integrate into various device designs.

Power Supplies (V): 3.3/5

Supporting multiple power supply options enhances flexibility in system design and compatibility.

No. of Terminals: 20

Having a high number of terminals allows for more connectivity options and versatility in circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables compact device designs.

Maximum High Level Input Current: 0.000001 Amp

The low input current minimizes power consumption and reduces heat dissipation, making the product energy-efficient.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in cold environments without issue.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connections, accommodating different PCB layouts.

Maximum Seated Height: 2.65 mm

The low seated height allows for slim and compact device designs, saving space in electronic assemblies.

Width: 7.5 mm

The compact width of the product enables it to fit into tight spaces and small form factor devices.

Maximum Output Low Current: 1.6 Amp

The high output low current capability allows the product to drive loads with sufficient power, ensuring reliable signal transmission.

Receiver No. of Bits: 2

Having a 2-bit receiver enhances data processing capabilities and improves signal reception accuracy.

Length: 12.8 mm

The moderate length of the product offers a balance between compactness and ease of handling during assembly.

Minimum Out Swing: 10 V

The high minimum output swing ensures strong signal integrity and robust communication in noisy environments.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product meets standard operating temperature requirements for most applications.

Maximum Receive Delay: 0 ns

The zero receive delay ensures real-time signal transmission, critical for time-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable electrical connections, simplifying assembly processes.

Interface Standard: EIA-232

Compliance with the EIA-232 interface standard ensures compatibility with a wide range of communication protocols and systems.

Maximum Supply Current: 1 mA

The low maximum supply current consumption reduces power requirements and extends battery life in portable devices.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide noise immunity and signal stability, ensuring reliable data transmission.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in electronic systems, maximizing compatibility with existing designs.

Terminal Pitch: 1.27 mm

The tight terminal pitch enables dense PCB layouts and compact circuit designs, ideal for miniaturized devices.

Driver No. of Bits: 2

Having a 2-bit driver enhances signal transmission accuracy and processing capabilities, improving overall system performance.

Interface IC Type: LINE TRANSCEIVER

The LINE TRANSCEIVER interface IC type supports bidirectional communication and signal conversion, making it versatile for various applications.

Technical Specifications

Line Drivers & Receivers TRSF3222CDW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TRSF3222CDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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