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TRSF3222CDBR

Texas Instruments

TRSF3222CDBR by Texas Instruments

TRSF3222CDBR by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 20 terminals, and 1mA max supply current. It operates in commercial temperature range of 0-70°C, suitable for EIA-232 interface applications requiring small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,239 parts In-Stock

1+ parts

-

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8,239

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Digiode

USA . 1,304 parts In-Stock

1+ parts

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1,304

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,069 parts In-Stock

1+ parts

$8.879

100+ parts

-

1k+ parts

$9.561

10k+ parts

-

2,069

$8.879

-

$9.561

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IDEA Electronic Components Group

UK . 1,902 parts In-Stock

1+ parts

$9.976

100+ parts

$9.477

1k+ parts

$8.978

10k+ parts

-

1,902

$9.976

$9.477

$8.978

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ChromeModa Solutions

Germany . 529 parts In-Stock

1+ parts

$9.976

100+ parts

$8.180

1k+ parts

-

10k+ parts

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529

$9.976

$8.180

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One Stop Electronics

USA . 1,622 parts In-Stock

1+ parts

$10.500

100+ parts

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1,622

$10.500

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$13.686

100+ parts

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425

$13.686

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Corphita

USA . 2,286 parts In-Stock

1+ parts

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2,286

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DigiPath Technology Company

USA . 2,150 parts In-Stock

1+ parts

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100+ parts

$8.994

1k+ parts

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2,150

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$8.994

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Microchip USA

USA . 328 parts In-Stock

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328

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Overview

Discover the Texas Instruments TRSF3222CDBR, a top-of-the-line line driver and receiver designed to provide reliable communication in various applications. With Texas Instruments' reputation for quality and innovation, you can trust that this product delivers superior performance and durability. Ideal for industries such as telecommunications, industrial automation, and automotive, the TRSF3222CDBR offers unmatched value with its compact design, low power consumption, and high-speed data transfer capabilities. Upgrade your systems with the TRSF3222CDBR and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the line driver & receiver, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with various power sources.

No. of Functions: 2

Having multiple functions in one component adds value and efficiency to the product, reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into circuit designs and layouts, optimizing space usage.

Power Supplies (V): 3.3/5

Support for multiple power supply options provides flexibility for different operational requirements and environments.

No. of Terminals: 20

A higher number of terminals offer more connectivity options and enable the device to interface with a variety of other components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design enhances portability and ease of use, making it suitable for compact electronic devices.

Maximum High Level Input Current: 0.000001 Amp

Low input current consumption results in energy efficiency and reduced power usage, contributing to cost savings in the long run.

Minimum Supply Voltage: 3 V

Support for low supply voltage ensures compatibility with a wide range of systems and applications, enhancing versatility.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable performance in various environmental conditions, increasing the product's durability.

Minimum Operating Temperature: 0 °C

Capable of operating in low-temperature conditions, making it suitable for a wide range of applications in different climates.

Terminal Position: DUAL

Dual terminal position offers backup and redundancy, ensuring reliable connections and reducing the risk of signal loss.

Maximum Seated Height: 2 mm

Low seated height allows for a compact form factor and easy integration into space-constrained designs.

Width: 5.3 mm

Narrow width facilitates space-saving installation, making it suitable for applications with limited board real estate.

Maximum Output Low Current: 1.6 Amp

Capable of providing high output current for driving loads, offering robust performance for demanding applications.

Receiver No. of Bits: 2

2 bits of receiver data allow for basic communication and data transfer, suitable for simple applications that require minimal data processing.

Length: 7.2 mm

Compact length facilitates efficient board layout and integration, optimizing space utilization in electronic systems.

Minimum Out Swing: 10 V

A minimum output swing of 10V ensures reliable signal transmission and reception, making it suitable for long-distance communication.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the device is suitable for standard operating conditions in commercial applications.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission, making it ideal for applications that require instantaneous communication.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and easy assembly, enhancing reliability and ease of manufacturing.

Interface Standard: EIA-232

Compliance with EIA-232 standard ensures interoperability with a wide range of communication devices, enhancing compatibility.

Maximum Supply Current: 1 mA

Low supply current consumption reduces power usage and heat generation, contributing to energy efficiency and prolonging battery life.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and signal conditioning, ensuring reliable operation in noisy environments.

Nominal Supply Voltage: 3.3 V

Stable supply voltage of 3.3V ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and compact design, suitable for space-constrained applications.

Driver No. of Bits: 2

2 bits of driver data enable basic signal transmission and driving capabilities, suitable for simple communication tasks.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type ensures efficient signal conversion and communication between different systems, enhancing interoperability.

Technical Specifications

Line Drivers & Receivers TRSF3222CDBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3222CDBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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