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TRSF3221IDBG4

Texas Instruments

TRSF3221IDBG4 by Texas Instruments

TRSF3221IDBG4 by Texas Instruments is a Line Transceiver with 16 terminals, operating at 3.3V/5V. It features EIA-232 interface standard, Schmitt trigger input characteristics, and can handle up to 1.6A output low current. Ideal for industrial applications requiring reliable communication in temperature range of -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,929

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Digiode

USA . 3,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,753

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,128 parts In-Stock

1+ parts

$7.382

100+ parts

-

1k+ parts

$7.875

10k+ parts

-

2,128

$7.382

-

$7.875

-

IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$8.294

100+ parts

$7.879

1k+ parts

$7.465

10k+ parts

-

2,322

$8.294

$7.879

$7.465

-

ChromeModa Solutions

Germany . 1,912 parts In-Stock

1+ parts

$8.294

100+ parts

$6.801

1k+ parts

-

10k+ parts

-

1,912

$8.294

$6.801

-

-

AZTECH Wire

Italy . 676 parts In-Stock

1+ parts

$17.470

100+ parts

-

1k+ parts

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10k+ parts

-

676

$17.470

-

-

-

One Stop Electronics

USA . 1,449 parts In-Stock

1+ parts

$28.500

100+ parts

-

1k+ parts

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10k+ parts

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1,449

$28.500

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-

-

Corphita

USA . 2,917 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,917

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DigiPath Technology Company

USA . 2,300 parts In-Stock

1+ parts

-

100+ parts

$7.478

1k+ parts

-

10k+ parts

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2,300

-

$7.478

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Microchip USA

USA . 149 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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149

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Overview

Transform your electronic designs with the TRSF3221IDBG4 from Texas Instruments, a leading manufacturer known for quality and innovation. This line driver and receiver offers unparalleled reliability and performance in a compact package, making it ideal for a wide range of applications. From industrial automation to telecommunications, this versatile component delivers value by providing seamless communication and efficiency. Trust Texas Instruments to provide the solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, allowing for efficient use of space on the PCB.

Power Supplies (V): 3.3/5

Support for multiple power supply options (3.3V and 5V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components or systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style further enhances space-saving capabilities and allows for high-density PCB layouts.

Maximum High Level Input Current: 0.000001 Amp

Low high-level input current minimizes power consumption and reduces heat generation, contributing to energy efficiency.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures reliable operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures stable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for operation in cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections, enhancing overall system stability.

Maximum Seated Height: 2 mm

Low maximum seated height of 2mm minimizes the profile of the component on the PCB, aiding in space-constrained designs.

Width: 5.3 mm

Narrow width of 5.3mm enables efficient placement on the PCB and allows for compact system designs.

Maximum Output Low Current: 1.6 Amp

High maximum output low current rating of 1.6A ensures the capability to drive power-hungry components or peripherals.

Length: 6.2 mm

Compact length of 6.2mm contributes to a small footprint on the PCB and facilitates streamlined system integration.

Minimum Out Swing: 10 V

Minimum out swing of 10V guarantees reliable signal integrity and robust communication capabilities in various operating conditions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh industrial environments with fluctuating temperatures.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission and minimal latency, crucial for time-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly, improving overall product reliability.

Interface Standard: EIA-232

Compliance with EIA-232 interface standard ensures compatibility with a wide range of communication protocols and systems.

Maximum Supply Current: 1 mA

Low maximum supply current of 1mA minimizes power consumption and heat dissipation, contributing to energy efficiency.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and signal conditioning, enhancing overall signal integrity and reliability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation under regular operating conditions.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm enables high-density interconnections and compact PCB layouts, ideal for space-constrained designs.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional communication and signal conversion, making it suitable for a wide range of data transmission applications.

Technical Specifications

Line Drivers & Receivers TRSF3221IDBG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRSF3221IDBG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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