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TRS3243CDW

Texas Instruments

TRS3243CDW by Texas Instruments

TRS3243CDW by Texas Instruments is a Line Driver & Receiver with 5 functions, operating at 3.6V max supply voltage. It has a small outline package style and dual terminal position, suitable for EIA-232-F, TIA-232-F, V.28 interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,621 parts In-Stock

1+ parts

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4,621

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Digiode

USA . 3,932 parts In-Stock

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3,932

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,980 parts In-Stock

1+ parts

$8.791

100+ parts

-

1k+ parts

$9.474

10k+ parts

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1,980

$8.791

-

$9.474

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AZTECH Wire

Italy . 692 parts In-Stock

1+ parts

$8.850

100+ parts

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692

$8.850

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DigiPath Technology Company

USA . 67 parts In-Stock

1+ parts

$9.679

100+ parts

$8.905

1k+ parts

-

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67

$9.679

$8.905

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ChromeModa Solutions

Germany . 5,832 parts In-Stock

1+ parts

$9.877

100+ parts

$8.099

1k+ parts

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5,832

$9.877

$8.099

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

1+ parts

$9.877

100+ parts

$9.383

1k+ parts

$8.889

10k+ parts

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1,328

$9.877

$9.383

$8.889

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One Stop Electronics

USA . 423 parts In-Stock

1+ parts

$40.500

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423

$40.500

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Microchip USA

USA . 2,544 parts In-Stock

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2,544

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Corphita

USA . 2,229 parts In-Stock

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2,229

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Overview

Enhance your communication systems with the Texas Instruments TRS3243CDW Line Drivers & Receivers. Crafted with precision and reliability in mind, this product boasts top-notch quality and innovative design from a trusted manufacturer. Ideal for a wide range of applications, this compact device offers seamless integration and optimal performance. Experience the value of fast transmit delay, low output current, and dual terminal position, all at an affordable price point. Upgrade your technology today with the TRS3243CDW and elevate your connectivity game to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to external elements, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage ensures compatibility with a wide range of systems and applications.

No. of Functions: 5

With multiple functions in a single device, the product offers versatility and efficiency in signal transmission and reception.

Package Shape: RECTANGULAR

The rectangular package shape is compact and convenient for PCB layout and integration.

Maximum Transmit Delay: 150 ns

Low transmit delay ensures fast and efficient data transmission, critical for real-time applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for flexibility in different system configurations.

No. of Terminals: 28

A high number of terminals accommodate various connections, enhancing connectivity options for the device.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact electronic devices.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirement reduces power consumption and ensures efficient operation.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and environments.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows for reliable operation in varying environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures performance in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides corrosion resistance and reliable connections, ensuring product longevity.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and connection options in a circuit design.

Maximum Seated Height: 2.65 mm

Low seated height contributes to a sleek and compact design, ideal for space-constrained applications.

Width: 7.5 mm

The narrow width of the product allows for efficient use of space on a PCB layout.

Maximum Output Low Current: 1.6 Amp

High maximum output low current capability ensures reliable signal transmission even in demanding conditions.

Receiver No. of Bits: 5

A higher number of bits in the receiver allows for more precise and accurate signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature simplifies the manufacturing process and reduces the risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during assembly.

Length: 17.9 mm

The compact length of the product contributes to a space-efficient design.

Minimum Out Swing: 10 V

The minimum output swing level of 10 V ensures robust signal strength for effective communication.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard temperature ranges, suitable for most applications.

Maximum Receive Delay: 150 ns

Low receive delay facilitates quick reception and processing of incoming signals.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical stability and ease of soldering during assembly.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry-standard interface specifications ensures seamless integration with existing systems and components.

Maximum Supply Current: 1 mA

Low maximum supply current requirement minimizes power consumption for energy-efficient operation.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise tolerance and signal stability for reliable data reception.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power sources and voltage levels.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for high-density mounting and space-saving on a PCB.

Driver No. of Bits: 3

Three bits in the driver enable precise control and modulation of output signals for efficient data transmission.

Interface IC Type: LINE TRANSCEIVER

The use of a line transceiver interface IC type ensures reliable and high-speed data transmission between systems.

Technical Specifications

Line Drivers & Receivers TRS3243CDW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

150 ns

Width:

7.5 mm

Trade Compliance

TRS3243CDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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