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TRS3238IDBRG4

Texas Instruments

TRS3238IDBRG4 by Texas Instruments

TRS3238IDBRG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It features EIA-232-F, TIA-232-F, V.28 interface standard and is ideal for industrial applications requiring a small outline package style with dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,214 parts In-Stock

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7,214

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Digiode

USA . 3,053 parts In-Stock

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3,053

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,329 parts In-Stock

1+ parts

$5.274

100+ parts

-

1k+ parts

$5.898

10k+ parts

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2,329

$5.274

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$5.898

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DigiPath Technology Company

USA . 963 parts In-Stock

1+ parts

$5.807

100+ parts

$5.343

1k+ parts

-

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963

$5.807

$5.343

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ChromeModa Solutions

Germany . 3,206 parts In-Stock

1+ parts

$5.926

100+ parts

$4.859

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3,206

$5.926

$4.859

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IDEA Electronic Components Group

UK . 143 parts In-Stock

1+ parts

$5.926

100+ parts

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$5.333

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143

$5.926

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$5.333

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AZTECH Wire

Italy . 615 parts In-Stock

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$6.160

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615

$6.160

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One Stop Electronics

USA . 1,473 parts In-Stock

1+ parts

$28.500

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1,473

$28.500

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Component Stockers USA

USA . 497 parts In-Stock

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$99.990

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497

$99.990

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Corphita

USA . 2,270 parts In-Stock

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2,270

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Microchip USA

USA . 196 parts In-Stock

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196

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Overview

Experience superior quality and reliability with the TRS3238IDBRG4 by Texas Instruments, a leading manufacturer in the industry. This line driver and receiver offers exceptional performance across a wide range of applications, providing customers with unmatched value and benefits. With its advanced features and innovative design, this product ensures seamless communication and efficient operation. Trust Texas Instruments for cutting-edge technology that delivers on both quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of strength and light weight, making the product durable and easy to handle.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Can handle high voltage inputs, providing flexibility in the range of power sources that can be used with the product.

No. of Functions: 3

Multiple functions in a single package reduce the need for additional components, saving space and cost in the design.

Package Shape: RECTANGULAR

Compact rectangular shape allows for efficient layout on circuit boards and easy integration into electronic systems.

Power Supplies (V): 3.3/5

Supports multiple power supply voltages, offering compatibility with a range of systems and applications.

No. of Terminals: 28

Sufficient number of terminals for connecting to various external components, enabling versatile use in different circuit configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact size and small terminal pitch allow for high-density mounting, maximizing space efficiency on circuit boards.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirement ensures minimal power consumption and reduces the risk of overheating in the system.

Minimum Supply Voltage: 3 V

Operates reliably at low supply voltages, suitable for applications where power efficiency is crucial.

Maximum Operating Temperature: 85 °C

Wide temperature range allows for operation in harsh environments, increasing the product's reliability and versatility.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, making it suitable for diverse industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal layout facilitates stable connections and enhances signal integrity, ensuring reliable data transmission.

Maximum Seated Height: 2 mm

Low-profile design minimizes the overall height of the component, enabling compact and space-efficient circuit board layouts.

Width: 5.3 mm

Narrow width allows for flexibility in placement and arrangement on the circuit board, optimizing use of available space.

Maximum Output Low Current: 1.6 Amp

Capable of driving high-current loads with low output impedance, ensuring robust signal transmission and performance.

Technical Specifications

Line Drivers & Receivers TRS3238IDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

5

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

TRS3238IDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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