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TPSI3050SDWZR

Texas Instruments

TPSI3050SDWZR by Texas Instruments

TPSI3050SDWZR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and 125°C max operating temp. Ideal for power supply support circuits in various applications due to its small outline package and adjustable threshold feature.

Median Price

$4.290

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,545 parts In-Stock

1+ parts

$3.414

100+ parts

$2.991

1k+ parts

$1.690

10k+ parts

-

5,545

$3.414

$2.991

$1.690

-

DigiKey

USA . 1,108 parts In-Stock

1+ parts

$4.290

100+ parts

$2.704

1k+ parts

$2.418

10k+ parts

$2.335

1,108

$4.290

$2.704

$2.418

$2.335

Mouser Electronics

USA . 512 parts In-Stock

1+ parts

$4.290

100+ parts

$2.710

1k+ parts

$2.410

10k+ parts

$2.330

512

$4.290

$2.710

$2.410

$2.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,803 parts In-Stock

1+ parts

$3.243

100+ parts

-

1k+ parts

-

10k+ parts

-

3,803

$3.243

-

-

-

Vyrian

USA . 4,056 parts In-Stock

1+ parts

$3.414

100+ parts

-

1k+ parts

-

10k+ parts

-

4,056

$3.414

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,286 parts In-Stock

1+ parts

$2.900

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$2.900

-

-

-

Semicontronic

India . 1,937 parts In-Stock

1+ parts

$2.900

100+ parts

$2.828

1k+ parts

$2.813

10k+ parts

-

1,937

$2.900

$2.828

$2.813

-

Corphita

USA . 1,904 parts In-Stock

1+ parts

$3.073

100+ parts

-

1k+ parts

-

10k+ parts

-

1,904

$3.073

-

-

-

Corohmni

South Africa . 285 parts In-Stock

1+ parts

$3.414

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$3.414

-

-

-

Overview

Elevate your power management capabilities with the TPSI3050SDWZR by Texas Instruments. Crafted with precision and expertise, this power management IC boasts top-notch quality and durability guaranteed by its renowned manufacturer. Ideal for a wide range of applications, this versatile product offers unmatched value, benefits, and advantages to customers seeking reliable and efficient power supply support circuits. Experience seamless performance and peace of mind knowing that you're investing in a superior product that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

Surface Mount : YES

Easy to install and saves space on the PCB.

Nominal Supply Voltage (Vsup) : 3.3 V

Optimal voltage for efficient power management.

Maximum Operating Temperature : 125 °C

Can withstand high temperatures, increasing product reliability.

Terminal Finish : Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish for long-lasting performance.

Width (mm) : 5.85 mm

Compact size for space-constrained applications.

Minimum Supply Voltage (Vsup) : 3 V

Can function with low input voltage, providing flexibility.

Nominal Threshold Voltage (V) : 2.55

Precise threshold voltage for accurate power management.

Maximum Supply Current (Isup) : 254 mA

High supply current capability for demanding applications.

Terminal Form : GULL WING

Allows for easy soldering and secure connection.

Maximum Supply Voltage (Vsup) : 5.5 V

Wide input voltage range for compatibility with different power sources.

Adjustable Threshold : YES

Option to adjust threshold voltage for custom power management settings.

Technical Specifications

Power Management ICs TPSI3050SDWZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Gate drive voltage(V) : 10

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

7.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.45

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.8 mm

Maximum Supply Current (Isup):

254 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

2.55

Width (mm):

5.85 mm

Trade Compliance

TPSI3050SDWZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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