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TPS79929DDCR

Texas Instruments

TPS79929DDCR by Texas Instruments

TPS79929DDCR by Texas Instruments is a CMOS technology regulator with a nominal output voltage of 2.9V and max output current of 0.2A. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring stable power supply, such as IoT devices and portable electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,585 parts In-Stock

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8,585

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Digiode

USA . 752 parts In-Stock

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752

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Parana Technologies

USA . 1,712 parts In-Stock

1+ parts

$5.843

100+ parts

-

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$6.627

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1,712

$5.843

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$6.627

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DigiPath Technology Company

USA . 880 parts In-Stock

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$6.434

100+ parts

$5.919

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880

$6.434

$5.919

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Semicontronic

India . 738 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

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$6.305

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738

$6.500

$6.338

$6.305

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One Stop Electronics

USA . 280 parts In-Stock

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$6.500

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280

$6.500

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ChromeModa Solutions

Germany . 4,455 parts In-Stock

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$6.565

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$5.383

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4,455

$6.565

$5.383

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

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$6.565

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$5.908

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1,155

$6.565

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$5.908

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AZTECH Wire

Italy . 879 parts In-Stock

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$12.457

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879

$12.457

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Ampacity Inc.

Singapore . 568 parts In-Stock

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$13.500

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568

$13.500

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Corohmni

South Africa . 398 parts In-Stock

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398

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Corphita

USA . 382 parts In-Stock

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Overview

Elevate your electronic designs with the TPS79929DDCR by Texas Instruments, a premium quality regulator that guarantees reliable performance and precision. Crafted by the renowned manufacturer, Texas Instruments, this product belongs to the category of Other Function Regulators, offering a wide range of applications in various industries. With its cutting-edge technology and durable construction, this regulator ensures optimal functionality and efficiency. Experience the value of seamless operation and unmatched reliability with the TPS79929DDCR, providing customers with the advantage of superior quality and performance for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the regulator lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount design allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can withstand demanding environmental conditions.

Technology: CMOS

CMOS technology provides efficient power management and low power consumption, enhancing the overall performance of the regulator.

Nominal Output Voltage-1: 2.9 V

A stable output voltage of 2.9V ensures reliable and consistent power supply to connected devices.

Maximum Output Current-1: 0.2 A

Capable of delivering a maximum output current of 0.2A, this regulator can power a variety of electronic components.

Nominal Dropout Voltage-1: 0.1 V

Low dropout voltage of 0.1V minimizes power loss and improves efficiency in voltage regulation.

Technical Specifications

Other Function Regulators TPS79929DDCR attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.1 V

Maximum Input Voltage Absolute:

7 V

JESD-30 Code:

R-PDSO-G5

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Nominal Output Voltage-1:

2.9 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

2 %

Trade Compliance

TPS79929DDCR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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