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TPS73216MDRBREP

Texas Instruments

TPS73216MDRBREP by Texas Instruments

TPS73216MDRBREP by Texas Instruments is a BICMOS technology regulator with 1.6V output voltage and 0.25A max current. It has a small outline package, surface mountable, and ideal for applications requiring precise voltage regulation in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,271 parts In-Stock

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Digiode

USA . 3,352 parts In-Stock

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3,352

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Distributors (Availability)

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Parana Technologies

USA . 1,455 parts In-Stock

1+ parts

$7.964

100+ parts

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$8.539

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1,455

$7.964

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$8.539

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DigiPath Technology Company

USA . 184 parts In-Stock

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$8.769

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184

$8.769

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ChromeModa Solutions

Germany . 6,187 parts In-Stock

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$8.948

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$7.337

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6,187

$8.948

$7.337

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IDEA Electronic Components Group

UK . 685 parts In-Stock

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$8.948

100+ parts

$8.501

1k+ parts

$8.053

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685

$8.948

$8.501

$8.053

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One Stop Electronics

USA . 457 parts In-Stock

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$10.500

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457

$10.500

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AZTECH Wire

Italy . 691 parts In-Stock

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$12.250

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691

$12.250

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Semicontronic

India . 814 parts In-Stock

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$18.500

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$18.038

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$17.945

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814

$18.500

$18.038

$17.945

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Ampacity Inc.

Singapore . 1,078 parts In-Stock

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$22.500

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1,078

$22.500

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Corphita

USA . 4,893 parts In-Stock

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Corohmni

South Africa . 472 parts In-Stock

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Overview

Discover the TPS73216MDRBREP by Texas Instruments, a high-quality Other Function Regulator that offers reliable performance and efficiency. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications. With its advanced BICMOS technology and compact design, it provides a stable output voltage with minimal dropout. Trust in Texas Instruments to deliver cutting-edge solutions for your power management needs. Experience the value and benefits that the TPS73216MDRBREP can bring to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the regulator, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on a circuit board, saving space and facilitating a more efficient design.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, resulting in improved performance, low power consumption, and high integration capabilities.

Package Shape: RECTANGULAR

Rectangular shape simplifies the design and integration of the regulator into different electronic systems, making it versatile and adaptable to various applications.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder joint fractures and offer better thermal performance, enhancing the overall reliability of the regulator.

Packing Method: TR

TR packing method ensures safe and secure transportation of the regulators, minimizing the risk of damage during shipping and handling.

Maximum Voltage Tolerance: 1 %

1% voltage tolerance ensures precise and stable output voltage, meeting the requirements for consistent performance in various electronic devices.

Nominal Output Voltage-1: 1.6 V

1.6V nominal output voltage provides a reliable power supply for connected components, ensuring optimal functionality and performance.

No. of Terminals: 8

8 terminals offer flexibility in connecting the regulator to other circuitry, allowing for easy integration and customization as per specific requirements.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact electronic devices where size is a critical factor in design.

Adjustability: FIXED

Fixed adjustability simplifies the usage and installation of the regulator, eliminating the need for complex adjustments and ensuring a stable output voltage.

Terminal Pitch: 0.635 mm

0.635mm terminal pitch allows for precise and secure connection of the regulator, ensuring reliable performance and reducing the risk of electrical interference.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting and connecting the regulator, facilitating easy integration into different circuit configurations.

Maximum Output Current-1: 0.25 A

0.25A maximum output current ensures sufficient power supply for connected components, making it suitable for a wide range of electronic applications and devices.

Nominal Dropout Voltage-1: 0.04 V

0.04V nominal dropout voltage minimizes power loss and ensures efficient energy conversion, resulting in improved overall performance and energy efficiency.

Maximum Input Voltage Absolute: 6 V

6V maximum input voltage absolute allows for compatibility with different power sources, making the regulator versatile and suitable for various electronic systems and configurations.

Technical Specifications

Other Function Regulators TPS73216MDRBREP attributes and parameters. Explore more Other Function Regulators devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.04 V

Maximum Input Voltage Absolute:

6 V

JESD-30 Code:

R-PDSO-N8

No. of Outputs:

1

No. of Terminals:

8

Maximum Output Current-1:

.25 A

Nominal Output Voltage-1:

1.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

1 %

Trade Compliance

TPS73216MDRBREP Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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