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TPS75333QPWPRQ1

Texas Instruments

TPS75333QPWPRQ1 by Texas Instruments

TPS75333QPWPRQ1 by Texas Instruments is a PMOS LDO regulator with 3.3V output, 1.5A current, and 0.3V dropout voltage ideal for automotive applications (AEC-Q100). It comes in a small outline package with gull wing terminals and operates b/w -40 to 125°C, making it suitable for various automotive electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,263 parts In-Stock

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Digiode

USA . 1,210 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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Parana Technologies

USA . 490 parts In-Stock

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$2.602

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$3.092

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490

$2.602

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$3.092

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DigiPath Technology Company

USA . 602 parts In-Stock

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$2.866

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$2.636

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602

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

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$2.924

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$2.632

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$2.924

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ChromeModa Solutions

Germany . 1,955 parts In-Stock

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$2.924

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$2.398

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$2.924

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Ampacity Inc.

Singapore . 1,043 parts In-Stock

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$3.500

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One Stop Electronics

USA . 504 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 214 parts In-Stock

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$9.460

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Microchip USA

USA . 5,414 parts In-Stock

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Kepictronics

USA . 600 parts In-Stock

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Corphita

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Aranea Global

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Overview

Power your electronic devices with the reliable and efficient TPS75333QPWPRQ1 Fixed Regulator by Texas Instruments. Designed with cutting-edge PMOS technology, this regulator ensures stable and precise voltage output, making it ideal for a wide range of applications. With its small outline package and dual-terminal position, this regulator is easy to integrate into any circuit design. Trust in Texas Instruments' reputation for quality and innovation, and experience the superior performance and durability that the TPS75333QPWPRQ1 offers. Upgrade your electronics with this top-of-the-line LDO regulator today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the regulator, making it suitable for a variety of applications.

Maximum Dropout Voltage: 1.3 V

The low maximum dropout voltage ensures efficient regulation of the output voltage, enhancing the stability and reliability of the device.

Surface Mount: YES

Being surface mountable makes the regulator easy to integrate into circuit boards, saving space and simplifying assembly processes.

Operating Temperature (TJ-Max): 125 °C

With a high operating temperature, this regulator can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Technology: PMOS

The PMOS technology used in this regulator provides efficient power management and low power consumption, contributing to overall system efficiency.

Nominal Output Voltage: 3.3 V

The stable 3.3V output voltage makes this regulator ideal for powering sensitive electronic components and ensuring proper functionality.

Maximum Output Current: 1.5 A

The high maximum output current capability allows this regulator to power multiple components or devices simultaneously, making it versatile for various applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO TPS75333QPWPRQ1 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.16 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

5 V

Minimum Input Voltage:

3.666 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Maximum Line Regulation:

.0023 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

20

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1.5 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

PMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

4.4 mm

Trade Compliance

TPS75333QPWPRQ1 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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