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TPS65983BAZQZR

Texas Instruments

TPS65983BAZQZR by Texas Instruments

TPS65983BAZQZR by Texas Instruments is a 96-terminal Power Management IC with a nominal voltage of 3.3V, suitable for power supply support circuits. It features a grid array package style with very thin profile and fine pitch, making it ideal for applications requiring precise power management in compact spaces. Operating temperature ranges from -10 to 85°C, ensuring reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,734 parts In-Stock

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2,734

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Digiode

USA . 2,475 parts In-Stock

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2,475

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,062 parts In-Stock

1+ parts

$2.500

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1,062

$2.500

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Semicontronic

India . 621 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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621

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 890 parts In-Stock

1+ parts

$6.500

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890

$6.500

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AZTECH Wire

Italy . 720 parts In-Stock

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$7.521

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720

$7.521

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Parana Technologies

USA . 1,535 parts In-Stock

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$21.440

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$21.802

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1,535

$21.440

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$21.802

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DigiPath Technology Company

USA . 1,792 parts In-Stock

1+ parts

$23.608

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1,792

$23.608

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ChromeModa Solutions

Germany . 3,976 parts In-Stock

1+ parts

$24.090

100+ parts

$19.754

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3,976

$24.090

$19.754

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IDEA Electronic Components Group

UK . 843 parts In-Stock

1+ parts

$24.090

100+ parts

$22.886

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$21.681

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843

$24.090

$22.886

$21.681

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Microchip USA

USA . 4,716 parts In-Stock

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Lixinc

USA . 4,702 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,801 parts In-Stock

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Corphita

USA . 2,762 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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280

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Overview

Elevate your power management capabilities with the TPS65983BAZQZR by Texas Instruments. Crafted with precision and expertise, this Power Management IC is designed to optimize efficiency and performance in various applications. With a focus on quality and reliability, Texas Instruments ensures that this product exceeds industry standards, providing customers with unparalleled value and benefits. Experience seamless power supply support with this innovative solution, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making this product suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it ideal for compact electronic devices.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic systems, ensuring compatibility with a wide range of devices.

No. of Terminals: 96

Having 96 terminals provides ample connectivity options, allowing for versatile and flexible circuit configurations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance under stress.

Minimum Operating Temperature: -10 °C

The minimum operating temperature of -10°C allows for reliable operation in colder environments, making this product suitable for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Width (mm): 6 mm

The compact width of 6mm allows for space-efficient design and integration into small electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product plays a crucial role in maintaining stable power delivery and efficiency in electronic systems.

Maximum Supply Voltage (Vsup): 3.45 V

The maximum supply voltage of 3.45V ensures that the product can handle power fluctuations and surges, safeguarding the connected devices.

Technical Specifications

Power Management ICs TPS65983BAZQZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B96

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

2.85 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

TPS65983BAZQZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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