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TPS659163RGZT

Texas Instruments

TPS659163RGZT by Texas Instruments

TPS659163RGZT by Texas Instruments is a Power Management IC with 48 terminals and a nominal voltage of 3.8V. It features a max output current of 7A, making it ideal for industrial applications requiring precise power supply management in compact spaces. With a max switching frequency of 2700 kHz, this chip carrier package is suitable for high-performance devices that demand efficient power delivery.

Median Price

$10.564

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,083 parts In-Stock

1+ parts

$8.549

100+ parts

$6.969

1k+ parts

$4.646

10k+ parts

-

1,083

$8.549

$6.969

$4.646

-

Mouser Electronics

USA . 420 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

$7.240

10k+ parts

-

420

$12.580

-

$7.240

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,009 parts In-Stock

1+ parts

$6.330

100+ parts

-

1k+ parts

-

10k+ parts

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4,009

$6.330

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-

-

Digiode

USA . 2,587 parts In-Stock

1+ parts

$8.122

100+ parts

-

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2,587

$8.122

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 426 parts In-Stock

1+ parts

$6.330

100+ parts

-

1k+ parts

-

10k+ parts

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426

$6.330

-

-

-

Corphita

USA . 968 parts In-Stock

1+ parts

$7.694

100+ parts

-

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968

$7.694

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-

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Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

$11.632

100+ parts

-

1k+ parts

$12.029

10k+ parts

-

1,965

$11.632

-

$12.029

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DigiPath Technology Company

USA . 991 parts In-Stock

1+ parts

$12.809

100+ parts

$11.784

1k+ parts

-

10k+ parts

-

991

$12.809

$11.784

-

-

IDEA Electronic Components Group

UK . 1,926 parts In-Stock

1+ parts

$13.070

100+ parts

$12.416

1k+ parts

$11.763

10k+ parts

-

1,926

$13.070

$12.416

$11.763

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ChromeModa Solutions

Germany . 61 parts In-Stock

1+ parts

$13.070

100+ parts

$10.717

1k+ parts

-

10k+ parts

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61

$13.070

$10.717

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-

Semicontronic

India . 720 parts In-Stock

1+ parts

$15.820

100+ parts

$15.424

1k+ parts

$15.345

10k+ parts

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720

$15.820

$15.424

$15.345

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QUARKTWIN TECHNOLOGY LTD

USA . 15,422 parts In-Stock

1+ parts

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15,422

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Overview

Unleash the power of cutting-edge technology with the TPS659163RGZT by Texas Instruments. Crafted with precision and expertise, this Power Management IC is designed to deliver top-notch performance across a wide range of applications. From industrial settings to consumer electronics, this chip carrier with a very thin profile offers unparalleled reliability and efficiency. With its nickel palladium gold finish and maximum output voltage of 3.3V, this innovative solution ensures optimal functionality and seamless integration. Trust Texas Instruments to provide you with the quality and value you deserve. Elevate your projects with the TPS659163RGZT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable option for the package, making it suitable for various applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.8 V

Matches common supply voltage requirements for many electronic devices, ensuring compatibility.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Maximum Output Voltage: 3.3 V

Provides a stable and reliable output voltage for connected devices, ensuring proper functioning.

Maximum Output Current: 7 A

High output current capability allows for powering multiple components or devices simultaneously.

Technical Specifications

Power Management ICs TPS659163RGZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Outputs:

10

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

7 A

Maximum Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

2700 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

TPS659163RGZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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