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TPS659119DAIPFPRQ1

Texas Instruments

TPS659119DAIPFPRQ1 by Texas Instruments

TPS659119DAIPFPRQ1 by Texas Instruments is a Power Management IC with 80 terminals, operating at -40 to 85°C. It has 11 channels, outputting up to 1.5A at 3.3V, suitable for industrial applications requiring precise power supply management in compact spaces.

Median Price

$8.427

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,500 parts In-Stock

1+ parts

$8.427

100+ parts

$6.870

1k+ parts

$4.580

10k+ parts

-

2,500

$8.427

$6.870

$4.580

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,154 parts In-Stock

1+ parts

$8.006

100+ parts

-

1k+ parts

-

10k+ parts

-

3,154

$8.006

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-

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Vyrian

USA . 6,163 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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6,163

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,199 parts In-Stock

1+ parts

$5.660

100+ parts

-

1k+ parts

$6.456

10k+ parts

-

2,199

$5.660

-

$6.456

-

ChromeModa Solutions

Germany . 5,555 parts In-Stock

1+ parts

$6.359

100+ parts

$5.214

1k+ parts

-

10k+ parts

-

5,555

$6.359

$5.214

-

-

IDEA Electronic Components Group

UK . 159 parts In-Stock

1+ parts

$6.359

100+ parts

-

1k+ parts

$5.723

10k+ parts

-

159

$6.359

-

$5.723

-

Semicontronic

India . 2,295 parts In-Stock

1+ parts

$7.160

100+ parts

$6.981

1k+ parts

$6.945

10k+ parts

-

2,295

$7.160

$6.981

$6.945

-

Corphita

USA . 3,395 parts In-Stock

1+ parts

$7.584

100+ parts

-

1k+ parts

-

10k+ parts

-

3,395

$7.584

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-

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Corohmni

South Africa . 271 parts In-Stock

1+ parts

$8.427

100+ parts

-

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-

10k+ parts

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271

$8.427

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-

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AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$9.360

100+ parts

-

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195

$9.360

-

-

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Ampacity Inc.

Singapore . 2,444 parts In-Stock

1+ parts

$15.590

100+ parts

-

1k+ parts

-

10k+ parts

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2,444

$15.590

-

-

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Microchip USA

USA . 2,128 parts In-Stock

1+ parts

$17.490

100+ parts

$17.240

1k+ parts

$17.110

10k+ parts

$16.990

2,128

$17.490

$17.240

$17.110

$16.990

Component Stockers USA

USA . 4,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.940

10k+ parts

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4,678

-

-

$4.940

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DigiPath Technology Company

USA . 335 parts In-Stock

1+ parts

-

100+ parts

$5.733

1k+ parts

-

10k+ parts

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335

-

$5.733

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Overview

Unlock the power of your devices with the TPS659119DAIPFPRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that provide reliable performance and efficiency. This versatile product is perfect for a wide range of applications, offering customers the value of a stable power supply, increased functionality, and enhanced performance for their electronic devices. Say goodbye to power concerns and hello to seamless operation with the TPS659119DAIPFPRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product light-weight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high quality and reliability, making it suitable for automotive applications where robustness is essential.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage is commonly used in many electronic systems, ensuring compatibility with a wide range of devices.

Power Supplies (V): 1.8/5,3/5

The multiple power supply options offer flexibility in powering different components of a system, making the product versatile in various applications.

No. of Terminals: 80

The large number of terminals provide ample connectivity options, allowing for complex circuit designs and functionality.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer different thermal management options, form factors, and mounting choices to suit specific design requirements.

Minimum Output Voltage: 0.6 V

The low minimum output voltage allows for powering sensitive components or devices that require minimal voltage levels.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3V provides sufficient power for most applications, catering to a wide range of devices and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in harsh environments or conditions without compromising functionality.

Technical Specifications

Power Management ICs TPS659119DAIPFPRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED SUPPLY VOLTAGE RANGE FROM 1.7V TO 5.5V, 2.7V TO 5.5V, 4V TO 5.5V

Adjustable Threshold:

YES

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

11

No. of Functions:

1

No. of Outputs:

11

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5,3/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switching Frequency:

3000 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

TPS659119DAIPFPRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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