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TPS65911062A2ZRCP

Texas Instruments

TPS65911062A2ZRCP by Texas Instruments

TPS65911062A2ZRCP by Texas Instruments is a Power Management IC with 98 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and offers 13 channels with a max switching frequency of 3300 kHz. Ideal for power supply management circuits in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,240 parts In-Stock

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Digiode

USA . 808 parts In-Stock

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808

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Distributors (Availability)

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Ampacity Inc.

Singapore . 630 parts In-Stock

1+ parts

$0.500

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630

$0.500

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One Stop Electronics

USA . 338 parts In-Stock

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$6.500

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338

$6.500

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Semicontronic

India . 630 parts In-Stock

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$7.500

100+ parts

$7.312

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$7.275

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630

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 422 parts In-Stock

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$10.778

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422

$10.778

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Component Stockers USA

USA . 520 parts In-Stock

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$99.990

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520

$99.990

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Corphita

USA . 1,318 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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Overview

Elevate your power management capabilities with the TPS65911062A2ZRCP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in their products. The TPS65911062A2ZRCP is a versatile Power Management IC that offers a wide range of applications, providing customers with enhanced efficiency and performance. With its compact design and advanced features, this product ensures seamless integration and optimal functionality in various electronic devices. Upgrade your power management system today with the TPS65911062A2ZRCP and experience the superior value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8V allows for compatibility with a wide range of power sources, making it versatile for different systems.

No. of Terminals: 98

Having 98 terminals provides flexibility and connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in challenging environments with elevated temperatures.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of Tin/Silver/Copper terminal finish offers good conductivity and corrosion resistance, enhancing the overall durability of the IC.

Width (mm): 6 mm

The compact width of 6mm allows for efficient use of space on the PCB, especially in applications where size constraints are a concern.

No. of Channels: 13

Having 13 channels provides ample capacity for managing power distribution and control, making it suitable for complex power management requirements.

Moisture Sensitivity Level (MSL): 3

MSL 3 designation indicates that the IC can withstand moderate humidity levels during storage and assembly, ensuring product reliability in various operating conditions.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for flexibility in power input options, accommodating a broader range of power sources for the IC.

Technical Specifications

Power Management ICs TPS65911062A2ZRCP attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B98

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

13

No. of Functions:

1

No. of Outputs:

13

No. of Terminals:

98

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA98,8X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

3300 kHz

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+2.1V

Width (mm):

6 mm

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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