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TPS659109A1RSLR

Texas Instruments

TPS659109A1RSLR by Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

Median Price

$3.699

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 200 parts In-Stock

1+ parts

$3.699

100+ parts

$3.241

1k+ parts

$1.831

10k+ parts

-

200

$3.699

$3.241

$1.831

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,184 parts In-Stock

1+ parts

$3.514

100+ parts

-

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3,184

$3.514

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Vyrian

USA . 2,194 parts In-Stock

1+ parts

-

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2,194

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 200 parts In-Stock

1+ parts

$3.140

100+ parts

-

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-

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-

200

$3.140

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-

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Semicontronic

India . 200 parts In-Stock

1+ parts

$3.140

100+ parts

$3.062

1k+ parts

$3.046

10k+ parts

-

200

$3.140

$3.062

$3.046

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Corphita

USA . 307 parts In-Stock

1+ parts

$3.329

100+ parts

-

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307

$3.329

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Corohmni

South Africa . 155 parts In-Stock

1+ parts

$3.699

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155

$3.699

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Parana Technologies

USA . 2,131 parts In-Stock

1+ parts

$12.003

100+ parts

-

1k+ parts

$12.410

10k+ parts

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2,131

$12.003

-

$12.410

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DigiPath Technology Company

USA . 2,159 parts In-Stock

1+ parts

$13.216

100+ parts

-

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2,159

$13.216

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ChromeModa Solutions

Germany . 6,335 parts In-Stock

1+ parts

$13.486

100+ parts

$11.059

1k+ parts

-

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6,335

$13.486

$11.059

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IDEA Electronic Components Group

UK . 426 parts In-Stock

1+ parts

$13.486

100+ parts

$12.812

1k+ parts

$12.137

10k+ parts

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426

$13.486

$12.812

$12.137

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AZTECH Wire

Italy . 92 parts In-Stock

1+ parts

$15.250

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-

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92

$15.250

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Microchip USA

USA . 2,056 parts In-Stock

1+ parts

$15.990

100+ parts

$15.890

1k+ parts

$15.840

10k+ parts

$15.790

2,056

$15.990

$15.890

$15.840

$15.790

Technical Specifications

Power Management ICs TPS659109A1RSLR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

12

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

3000 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

TPS659109A1RSLR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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