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TPS65642YFFR

Texas Instruments

TPS65642YFFR by Texas Instruments

TPS65642YFFR by Texas Instruments is a Graphics Display Driver with a supply voltage range of 2.6V to 6V and max current of 7.5mA. It features a very thin profile package style, suitable for Liquid Crystal Display driver applications due to its low power consumption and compact size.

Median Price

$1.848

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,000 parts In-Stock

1+ parts

$1.848

100+ parts

$1.620

1k+ parts

$0.915

10k+ parts

-

18,000

$1.848

$1.620

$0.915

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,345 parts In-Stock

1+ parts

$1.756

100+ parts

-

1k+ parts

-

10k+ parts

-

1,345

$1.756

-

-

-

Vyrian

USA . 6,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,635

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,559 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

-

10k+ parts

-

1,559

$1.663

-

-

-

Parana Technologies

USA . 1,935 parts In-Stock

1+ parts

$8.030

100+ parts

-

1k+ parts

$8.611

10k+ parts

-

1,935

$8.030

-

$8.611

-

DigiPath Technology Company

USA . 646 parts In-Stock

1+ parts

$8.843

100+ parts

-

1k+ parts

-

10k+ parts

-

646

$8.843

-

-

-

ChromeModa Solutions

Germany . 5,815 parts In-Stock

1+ parts

$9.023

100+ parts

$7.399

1k+ parts

-

10k+ parts

-

5,815

$9.023

$7.399

-

-

IDEA Electronic Components Group

UK . 914 parts In-Stock

1+ parts

$9.023

100+ parts

$8.572

1k+ parts

$8.121

10k+ parts

-

914

$9.023

$8.572

$8.121

-

AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$17.510

100+ parts

-

1k+ parts

-

10k+ parts

-

626

$17.510

-

-

-

GreenTree Electronics

Israel . 3,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,788

-

-

-

-

Kepictronics

USA . 3,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,061

-

-

-

-

A-Z Elektronik GmbH

Germany . 345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

345

-

-

-

-

Overview

Elevate your display experience with the TPS65642YFFR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality graphics display drivers that exceed expectations. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and benefits. With its advanced features and reliable performance, the TPS65642YFFR ensures seamless operation and optimal results. Upgrade your display solutions with Texas Instruments today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for compact and efficient PCB layout, saving space and reducing overall product size.

Maximum Supply Voltage: 6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used in modern electronics, ensuring compatibility with standard PCB designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with very thin profile and fine pitch allows for high-density mounting, ideal for applications with limited space.

Minimum Supply Voltage: 2.6 V

Supports low supply voltages, making it suitable for battery-operated devices.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and reliability for stable operation.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during assembly.

Maximum Seated Height: 0.625 mm

Low profile design with maximum seated height of 0.625 mm enables slim and compact product designs.

Width: 2.8 mm

Narrow width of 2.8 mm saves space on the PCB and allows for efficient use of board real estate.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds helps prevent overheating and ensures proper soldering of the component.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering processes, ensuring reliable and robust connections on the PCB.

Length: 3.2 mm

Compact length of 3.2 mm allows for efficient placement on the PCB and contributes to a sleek product design.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and is commonly used in high-density mounting applications.

Maximum Supply Current: 7.5 mA

Low supply current of 7.5 mA helps minimize power consumption and heat generation in the system.

Input Characteristics: STANDARD

Standardized input characteristics ensure compatibility with a wide range of systems and devices.

Nominal Supply Voltage: 3.3 V

Optimal nominal supply voltage of 3.3 V ensures stable performance and compatibility with common power sources.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm allows for high-density mounting, enabling efficient use of PCB space.

Minimum fmax: 0.4 MHz

Minimum fmax of 0.4 MHz indicates high-speed operation capabilities, suitable for driving displays with fast refresh rates.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Designed specifically for driving liquid crystal displays, making it a specialized and high-performance choice for display applications.

Technical Specifications

Graphics Display Drivers TPS65642YFFR attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-XBGA-B56

JESD-609 Code:

e1

Length:

3.2 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Current:

7.5 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.8 mm

Minimum fmax:

.4 MHz

Trade Compliance

TPS65642YFFR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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