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TPS65182BRGZT

Texas Instruments

TPS65182BRGZT by Texas Instruments

TPS65182BRGZT by Texas Instruments is a Power Management IC with 48 terminals, operating voltage of 3.7V, and max output voltage of 17V. It is used in power supply support circuits, featuring a compact square package suitable for surface mounting applications with an adjustable threshold and high switching frequency up to 1000 kHz.

Median Price

$4.794

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,700 parts In-Stock

1+ parts

$5.450

100+ parts

$4.443

1k+ parts

$2.962

10k+ parts

-

3,700

$5.450

$4.443

$2.962

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.137

10k+ parts

$3.987

250

-

-

$4.137

$3.987

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,207 parts In-Stock

1+ parts

$5.178

100+ parts

-

1k+ parts

-

10k+ parts

-

4,207

$5.178

-

-

-

Vyrian

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,038 parts In-Stock

1+ parts

$3.807

100+ parts

-

1k+ parts

$4.297

10k+ parts

-

1,038

$3.807

-

$4.297

-

DigiPath Technology Company

USA . 2,119 parts In-Stock

1+ parts

$4.192

100+ parts

$3.857

1k+ parts

-

10k+ parts

-

2,119

$4.192

$3.857

-

-

ChromeModa Solutions

Germany . 6,959 parts In-Stock

1+ parts

$4.278

100+ parts

$3.508

1k+ parts

-

10k+ parts

-

6,959

$4.278

$3.508

-

-

IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$4.278

100+ parts

-

1k+ parts

$3.850

10k+ parts

-

961

$4.278

-

$3.850

-

Ampacity Inc.

Singapore . 1,897 parts In-Stock

1+ parts

$4.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,897

$4.630

-

-

-

Semicontronic

India . 1,753 parts In-Stock

1+ parts

$4.630

100+ parts

$4.514

1k+ parts

$4.491

10k+ parts

-

1,753

$4.630

$4.514

$4.491

-

Corphita

USA . 2,670 parts In-Stock

1+ parts

$4.905

100+ parts

-

1k+ parts

-

10k+ parts

-

2,670

$4.905

-

-

-

Corohmni

South Africa . 474 parts In-Stock

1+ parts

$5.450

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$5.450

-

-

-

Microchip USA

USA . 2,223 parts In-Stock

1+ parts

$14.240

100+ parts

$14.040

1k+ parts

$13.930

10k+ parts

$13.830

2,223

$14.240

$14.040

$13.930

$13.830

Overview

Unlock the power of efficient and reliable power management with the TPS65182BRGZT by Texas Instruments. This high-quality Power Management IC offers unparalleled performance and versatility, making it ideal for a wide range of applications. With Texas Instruments' renowned reputation for excellence, you can trust that this product delivers exceptional value and benefits to meet your power supply needs. Experience the advantages of this innovative solution and take your projects to the next level with the TPS65182BRGZT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during handling and operation.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, reducing manufacturing time and cost.

Nominal Supply Voltage (Vsup): 3.7 V

The nominal supply voltage is suitable for a wide range of applications, providing flexibility in usage.

No. of Terminals: 48

Having a high number of terminals allows for connection to multiple components, enhancing the functionality and versatility of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: -10 °C

The product can operate in low temperature environments, making it suitable for a variety of applications.

Maximum Output Voltage: 17 V

The high maximum output voltage allows for powering a wide range of devices, making the product versatile and adaptable.

Maximum Seated Height: 1 mm

The low seated height saves space on the PCB, making the product ideal for compact designs.

Minimum Supply Voltage (Vsup): 3 V

The product can operate within a wide range of supply voltages, accommodating different power sources.

Maximum Switching Frequency: 1000 kHz

The high switching frequency ensures efficient power management, making the product suitable for high-performance applications.

Technical Specifications

Power Management ICs TPS65182BRGZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Maximum Output Voltage:

17 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.7

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.9V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

TPS65182BRGZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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