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TPS650860A0RSKR

Texas Instruments

TPS650860A0RSKR by Texas Instruments

TPS650860A0RSKR by Texas Instruments is a Power Management IC with 64 terminals, operating at -40 to 85 °C. It has a max output voltage of 3.575 V and supports a switching frequency of up to 3100 kHz. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

$7.036

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,717 parts In-Stock

1+ parts

$7.036

100+ parts

$5.736

1k+ parts

$3.824

10k+ parts

-

8,717

$7.036

$5.736

$3.824

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,135 parts In-Stock

1+ parts

$6.684

100+ parts

-

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3,135

$6.684

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Vyrian

USA . 2,006 parts In-Stock

1+ parts

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2,006

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Cyclops Electronics Ltd

UK . 243 parts In-Stock

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243

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,676 parts In-Stock

1+ parts

$6.332

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-

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4,676

$6.332

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-

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Parana Technologies

USA . 2,036 parts In-Stock

1+ parts

$13.370

100+ parts

-

1k+ parts

$13.888

10k+ parts

-

2,036

$13.370

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$13.888

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AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$14.420

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607

$14.420

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DigiPath Technology Company

USA . 1,638 parts In-Stock

1+ parts

$14.722

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1,638

$14.722

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IDEA Electronic Components Group

UK . 694 parts In-Stock

1+ parts

$15.022

100+ parts

$14.271

1k+ parts

$13.520

10k+ parts

-

694

$15.022

$14.271

$13.520

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ChromeModa Solutions

Germany . 512 parts In-Stock

1+ parts

$15.022

100+ parts

$12.318

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-

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512

$15.022

$12.318

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Microchip USA

USA . 2,853 parts In-Stock

1+ parts

$24.820

100+ parts

$24.820

1k+ parts

-

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$24.820

2,853

$24.820

$24.820

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$24.820

Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Enhance the efficiency and reliability of your power management systems with the TPS650860A0RSKR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and performance. This Power Management IC is versatile and ideal for a wide range of applications. With its advanced features and benefits including adjustable threshold, 13 outputs, and a wide supply voltage range, this product offers exceptional value to customers. Upgrade your power systems today with the TPS650860A0RSKR and experience unmatched performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Nominal Supply Voltage (Vsup): 13 V

Suitable voltage for many power management applications, providing a stable power source.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, ensuring reliability under varying conditions.

Maximum Output Voltage: 3.575 V

Provides a stable and regulated output voltage for connected devices.

Minimum Supply Voltage (Vsup): 5.6 V

Wide range of supply voltage options allow for flexibility in different power supply setups.

Maximum Switching Frequency: 3100 kHz

High switching frequency allows for efficient power management and regulation.

No. of Outputs: 13

Multiple outputs provide versatility in powering various components in a system.

Technical Specifications

Power Management ICs TPS650860A0RSKR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

13

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

3.575 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

21 V

Minimum Supply Voltage (Vsup):

5.6 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Maximum Switching Frequency:

3100 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

TPS650860A0RSKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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