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TPS65053RGERG4

Texas Instruments

TPS65053RGERG4 by Texas Instruments

TPS65053RGERG4 by Texas Instruments is a Power Management IC with 24 terminals, operating voltage of 3.6V, and max output current of 1A. It is used in industrial applications requiring a compact chip carrier package with adjustable threshold voltage and high switching frequency up to 2475 kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 144,880 parts In-Stock

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Vyrian

USA . 3,510 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3,000 parts In-Stock

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3,000

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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ComSIT USA

USA . 3,000 parts In-Stock

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Digiode

USA . 2,874 parts In-Stock

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One Stop Electronics

USA . 233 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 422 parts In-Stock

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$10.170

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Parana Technologies

USA . 1,402 parts In-Stock

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$13.575

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$14.079

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$13.575

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ChromeModa Solutions

Germany . 1,835 parts In-Stock

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$15.253

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$12.507

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IDEA Electronic Components Group

UK . 81 parts In-Stock

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$15.253

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$14.490

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$13.728

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Corphita

USA . 3,375 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 716 parts In-Stock

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Overview

Enhance your power management systems with the TPS65053RGERG4 from Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. This Power Management IC offers seamless integration and superior performance, making it ideal for a wide range of applications. With its compact size, high efficiency, and adjustable thresholds, this product provides unmatched value and benefits to customers seeking a reliable and cost-effective solution. Upgrade your power management setup today with the TPS65053RGERG4 and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V ensures compatibility with a wide range of power sources.

No. of Terminals: 24

With 24 terminals, this product provides versatile connection options for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environments.

Minimum Output Voltage: 0.6 V

The minimum output voltage of 0.6V allows for efficient power delivery to connected devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish enhances conductivity and corrosion resistance.

Maximum Output Voltage: 6 V

The high maximum output voltage of 6V makes this product suitable for a wide range of power distribution applications.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm ensures space-efficient installation in compact devices.

Width (mm): 4 mm

The compact width of 4mm allows for easy integration into small electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V ensures efficient power delivery even in low voltage scenarios.

Maximum Switching Frequency: 2475 kHz

The high maximum switching frequency of 2475kHz enables rapid power regulation for responsive performance.

Maximum Supply Current (Isup): 0.21 mA

The low maximum supply current of 0.21mA minimizes power consumption for energy-efficient operation.

Maximum Output Current: 1 A

The high maximum output current of 1A allows for powering multiple devices simultaneously.

No. of Channels: 5

With 5 channels, this product can support multiple power distribution paths for enhanced flexibility.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and improves reliability.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that this product is resistant to moisture-related damage during storage and handling.

Technical Specifications

Power Management ICs TPS65053RGERG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

5

No. of Functions:

1

No. of Outputs:

5

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.21 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2475 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+1.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

TPS65053RGERG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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