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TPS65030YZKR

Texas Instruments

TPS65030YZKR by Texas Instruments

TPS65030YZKR by Texas Instruments is a Power Management IC with 25 terminals, Vsup ranging from 3V to 5V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temp of 260°C. Ideal for power supply management circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,388 parts In-Stock

1+ parts

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6,388

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Digiode

USA . 1,300 parts In-Stock

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1,300

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R&J Components

USA . 1,280 parts In-Stock

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1,280

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Distributors (Availability)

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One Stop Electronics

USA . 681 parts In-Stock

1+ parts

$7.500

100+ parts

-

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681

$7.500

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AZTECH Wire

Italy . 1,165 parts In-Stock

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$12.614

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1,165

$12.614

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Parana Technologies

USA . 1,413 parts In-Stock

1+ parts

$17.850

100+ parts

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$18.028

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1,413

$17.850

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$18.028

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DigiPath Technology Company

USA . 2,286 parts In-Stock

1+ parts

$19.655

100+ parts

$18.082

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2,286

$19.655

$18.082

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ChromeModa Solutions

Germany . 6,662 parts In-Stock

1+ parts

$20.056

100+ parts

$16.446

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6,662

$20.056

$16.446

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IDEA Electronic Components Group

UK . 237 parts In-Stock

1+ parts

$20.056

100+ parts

$19.053

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$18.050

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237

$20.056

$19.053

$18.050

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Corphita

USA . 685 parts In-Stock

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685

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Microchip USA

USA . 381 parts In-Stock

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381

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Overview

Unlock the power of efficient energy management with the TPS65030YZKR from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Power Management ICs like this one, designed for a range of applications. With its surface mount feature and industrial temperature grade, this compact package provides optimal performance and reliability. Experience the benefits of seamless power supply management and trust in Texas Instruments to meet your needs. Elevate your projects with the TPS65030YZKR and enjoy the advantages it brings to your work.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB mounting, making the product suitable for compact and modern electronic devices.

Nominal Supply Voltage (Vsup): 3.6 V

The specific nominal supply voltage of 3.6V ensures compatibility with a wide range of electronic devices and power sources.

No. of Terminals: 25

Having a higher number of terminals allows for more flexibility in connecting to different components within a circuit, increasing versatility.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand rigorous conditions and ensure reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product remains functional even in extremely cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Temperature Grade: INDUSTRIAL

Being classified as an industrial-grade product means it is designed to operate in harsh industrial environments, ensuring durability and reliability under challenging conditions.

Technical Specifications

Power Management ICs TPS65030YZKR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B25

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BGA

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TPS65030YZKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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