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TPS650242RHBRG4

Texas Instruments

TPS650242RHBRG4 by Texas Instruments

TPS650242RHBRG4 by Texas Instruments is a Power Management IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.5V to 6V and supports two channels. The IC is used in industrial applications for power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,139 parts In-Stock

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3,139

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Digiode

USA . 2,786 parts In-Stock

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2,786

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Distributors (Availability)

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Semicontronic

India . 613 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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-

613

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 1,405 parts In-Stock

1+ parts

$5.500

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1,405

$5.500

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Ampacity Inc.

Singapore . 710 parts In-Stock

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$6.500

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710

$6.500

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AZTECH Wire

Italy . 379 parts In-Stock

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$12.326

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379

$12.326

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Parana Technologies

USA . 277 parts In-Stock

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$22.104

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$22.703

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277

$22.104

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$22.703

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IDEA Electronic Components Group

UK . 465 parts In-Stock

1+ parts

$24.836

100+ parts

$23.594

1k+ parts

$22.352

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465

$24.836

$23.594

$22.352

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ChromeModa Solutions

Germany . 81 parts In-Stock

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$24.836

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$20.366

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81

$24.836

$20.366

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Component Stockers USA

USA . 798 parts In-Stock

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$99.990

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798

$99.990

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Corphita

USA . 4,985 parts In-Stock

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4,985

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Microchip USA

USA . 275 parts In-Stock

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275

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Corohmni

South Africa . 117 parts In-Stock

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DigiPath Technology Company

USA . 83 parts In-Stock

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$22.392

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83

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$22.392

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Overview

Elevate your power management solutions with the TPS650242RHBRG4 from Texas Instruments. Designed with precision and expertise, this Power Management IC offers unparalleled reliability and performance. Whether you're in the automotive, industrial or consumer electronics industry, this chip carrier with a very thin profile delivers exceptional power supply support circuitry. With adjustable thresholds and a wide temperature range, it's the perfect choice for your cutting-edge applications. Trust Texas Instruments to provide you with the quality and innovation you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable, this IC is easy to assemble and saves space on the PCB, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 3.6 V

With a nominal supply voltage of 3.6V, this IC is compatible with a wide range of systems and power sources.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even under demanding conditions.

Width (mm): 5 mm

The compact width of 5mm allows for efficient use of board space and enables the IC to be used in tight layouts.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V ensures compatibility with a wide range of power sources, enhancing versatility.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting, making this IC suitable for applications requiring compact design.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this IC can withstand standard PCB assembly processes without compromising reliability.

Adjustable Threshold: YES

The ability to adjust the threshold makes this IC versatile and customizable to suit a variety of power management requirements.

Technical Specifications

Power Management ICs TPS650242RHBRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

TPS650242RHBRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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