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TPS650241RHBR

Texas Instruments

TPS650241RHBR by Texas Instruments

TPS650241RHBR by Texas Instruments is a Power Management IC with 32 terminals, operating voltage of 3.6V, and max output current of 1.6A. It is used in industrial applications requiring a compact chip carrier package with very thin profile for power supply support circuits.

Median Price

$3.847

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,936 parts In-Stock

1+ parts

$3.847

100+ parts

$3.137

1k+ parts

$2.091

10k+ parts

-

19,936

$3.847

$3.137

$2.091

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,303 parts In-Stock

1+ parts

$3.655

100+ parts

-

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2,303

$3.655

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Vyrian

USA . 5,210 parts In-Stock

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5,210

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Chip Stock

USA . 3,000 parts In-Stock

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3,000

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Bristol Electronics

USA . 2,004 parts In-Stock

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2,004

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,847 parts In-Stock

1+ parts

$3.462

100+ parts

-

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1,847

$3.462

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Parana Technologies

USA . 898 parts In-Stock

1+ parts

$6.145

100+ parts

-

1k+ parts

$6.915

10k+ parts

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898

$6.145

-

$6.915

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DigiPath Technology Company

USA . 669 parts In-Stock

1+ parts

$6.766

100+ parts

$6.225

1k+ parts

-

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669

$6.766

$6.225

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ChromeModa Solutions

Germany . 2,075 parts In-Stock

1+ parts

$6.904

100+ parts

$5.661

1k+ parts

-

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2,075

$6.904

$5.661

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IDEA Electronic Components Group

UK . 1,223 parts In-Stock

1+ parts

$6.904

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1k+ parts

$6.214

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1,223

$6.904

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AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$12.620

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668

$12.620

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Microchip USA

USA . 3,000 parts In-Stock

1+ parts

$18.257

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3,000

$18.257

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$27.928

100+ parts

$25.414

1k+ parts

$22.901

10k+ parts

-

1,000

$27.928

$25.414

$22.901

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,150 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,397 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 367 parts In-Stock

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367

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Overview

Enhance your power management solutions with the TPS650241RHBR by Texas Instruments. Crafted with precision and innovation, this Power Management IC offers unparalleled reliability and efficiency for a wide range of applications. From industrial to consumer electronics, this product delivers superior performance and flexibility, ensuring optimal power distribution and control. Experience the value of Texas Instruments' cutting-edge technology with the TPS650241RHBR, where quality meets excellence in power management. Upgrade your systems today and unleash the full potential of your devices with this exceptional solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the Power Management ICs easy to handle and ensuring longevity.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time during assembly.

Nominal Supply Voltage (Vsup): 3.6 V

Operating at a nominal supply voltage of 3.6V ensures stable and efficient power delivery for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the Power Management ICs can withstand demanding industrial conditions.

Maximum Output Voltage: 6 V

The high maximum output voltage of 6V allows for versatile use in applications requiring higher voltage levels.

Maximum Output Current: 1.6 A

The high maximum output current of 1.6A ensures reliable power delivery for devices with varying power needs.

No. of Channels: 2

Having 2 channels allows for multiple output configurations, providing flexibility in powering different components.

Temperature Grade: INDUSTRIAL

Designed for industrial use, the Power Management ICs are built to withstand harsh environmental conditions and high temperatures.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of power management settings, catering to specific application requirements.

Technical Specifications

Power Management ICs TPS650241RHBR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Outputs:

6

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2550 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

TPS650241RHBR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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