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TPS65023RSBTG4

Texas Instruments

TPS65023RSBTG4 by Texas Instruments

TPS65023RSBTG4 by Texas Instruments is a Power Management IC with 3.6V nominal voltage, 1.7A max output current, and 2550 kHz max switching frequency. It is used in industrial applications for power supply support circuits due to its compact chip carrier package and adjustable threshold feature.

Median Price

$3.645

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.740

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10

$2.740

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Digiode

USA . 3,808 parts In-Stock

1+ parts

$4.550

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3,808

$4.550

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Chip Stock

USA . 22,739 parts In-Stock

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22,739

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Vyrian

USA . 7,842 parts In-Stock

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7,842

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Euro-Tech

UK . 142 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 8 parts In-Stock

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8

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,611 parts In-Stock

1+ parts

$2.740

100+ parts

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10k+ parts

$2.685

2,611

$2.740

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$2.685

Argo Parts USA

USA . 375 parts In-Stock

1+ parts

$2.740

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375

$2.740

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.740

100+ parts

$2.685

1k+ parts

$2.603

10k+ parts

$2.548

100

$2.740

$2.685

$2.603

$2.548

Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$3.950

100+ parts

-

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$4.422

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1,380

$3.950

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$4.422

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Ampacity Inc.

Singapore . 89 parts In-Stock

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$4.070

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89

$4.070

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Corphita

USA . 975 parts In-Stock

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$4.311

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975

$4.311

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DigiPath Technology Company

USA . 551 parts In-Stock

1+ parts

$4.349

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$4.001

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551

$4.349

$4.001

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ChromeModa Solutions

Germany . 4,660 parts In-Stock

1+ parts

$4.438

100+ parts

$3.639

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4,660

$4.438

$3.639

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IDEA Electronic Components Group

UK . 154 parts In-Stock

1+ parts

$4.438

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$3.994

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154

$4.438

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$3.994

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Corohmni

South Africa . 96 parts In-Stock

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$7.698

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96

$7.698

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AZTECH Wire

Italy . 379 parts In-Stock

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$8.391

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379

$8.391

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Microchip USA

USA . 1,685 parts In-Stock

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1,685

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Perfect Parts

USA . 160 parts In-Stock

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160

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Overview

Experience the power of efficient and reliable power management with the TPS65023RSBTG4 by Texas Instruments. Crafted by a trusted manufacturer, this Power Management IC offers high-quality performance and versatility in various applications. With its advanced features and innovative design, this product provides unmatched value and benefits to customers looking for a dependable solution to their power supply needs. Trust in Texas Instruments to deliver top-notch products like the TPS65023RSBTG4 that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal voltage for power management, providing stable performance.

No. of Terminals: 40

Sufficient number of terminals for connectivity options and flexibility in system design.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for reliable performance in various environments.

Maximum Output Voltage: 6 V

High output voltage capability for powering a variety of components.

Width (mm): 5 mm

Compact size for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage for efficient power management in low-power applications.

Maximum Switching Frequency: 2550 kHz

High switching frequency for enhanced power efficiency and performance.

No. of Outputs: 6

Multiple output channels for versatile power distribution.

Technical Specifications

Power Management ICs TPS65023RSBTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

1

No. of Outputs:

6

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.7 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.043 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

2550 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

TPS65023RSBTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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