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TPS65013RGZTG4

Texas Instruments

TPS65013RGZTG4 by Texas Instruments

TPS65013RGZTG4 by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 85 °C. It offers a max output current of 1A, switching frequency of 1500 kHz, and supports power supply circuits. Ideal for industrial applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,133 parts In-Stock

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Digiode

USA . 4,900 parts In-Stock

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4,900

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Semicontronic

India . 764 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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764

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 206 parts In-Stock

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$4.500

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$4.500

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One Stop Electronics

USA . 1,274 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 815 parts In-Stock

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$14.219

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815

$14.219

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Parana Technologies

USA . 836 parts In-Stock

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$17.461

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$17.659

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836

$17.461

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$17.659

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ChromeModa Solutions

Germany . 513 parts In-Stock

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$19.619

100+ parts

$16.088

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513

$19.619

$16.088

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IDEA Electronic Components Group

UK . 45 parts In-Stock

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$19.619

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$18.638

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$17.657

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45

$19.619

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$17.657

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Corphita

USA . 2,551 parts In-Stock

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Microchip USA

USA . 2,113 parts In-Stock

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DigiPath Technology Company

USA . 1,324 parts In-Stock

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$17.688

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$17.688

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Corohmni

South Africa . 403 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Overview

Elevate your power management needs with the TPS65013RGZTG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this chip carrier is designed to deliver optimal performance and efficiency. With a very thin profile and advanced features like adjustable threshold and maximum output current of 1A, this industrial-grade IC ensures seamless operation in any setting. Experience the superior value and benefits that Texas Instruments brings to the table with the TPS65013RGZTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making the product reliable and long-lasting.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.6 V

This voltage level is commonly used in many electronic devices, ensuring compatibility and efficient power management.

No. of Terminals: 48

Having a high number of terminals allows for versatile connections and configurations, increasing the product's functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform reliably in various environmental conditions without overheating.

Minimum Output Voltage: 0.85 V

The low minimum output voltage allows for efficient power conversion and control, making the product suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The product can operate in extremely cold conditions, ensuring reliable performance in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term reliability.

Maximum Output Voltage: 6.5 V

The high maximum output voltage allows for powering a variety of components and devices, increasing the product's versatility.

Width (mm): 7 mm

The compact width of the product makes it suitable for applications where space is limited, without compromising on performance.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage ensures efficient power management and compatibility with a wide range of power sources.

Maximum Switching Frequency: 1500 kHz

A high switching frequency allows for fast and efficient power conversion, improving the product's overall performance.

Maximum Output Current: 1 A

The high maximum output current capability enables the product to power multiple components simultaneously, making it versatile for different applications.

No. of Channels: 2

Having multiple channels allows for independent power control and distribution, enhancing flexibility in power management.

Moisture Sensitivity Level (MSL): 2

A low moisture sensitivity level indicates that the product is less susceptible to moisture damage, ensuring long-term reliability in various environments.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage capability makes the product suitable for applications that require higher voltage levels, increasing its versatility.

Adjustable Threshold: YES

The ability to adjust the threshold allows for precise control over power management settings, making the product customizable for specific requirements.

Technical Specifications

Power Management ICs TPS65013RGZTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Maximum Output Voltage:

6.5 V

Minimum Output Voltage:

.85 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

1500 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

TPS65013RGZTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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