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TPS630252YFFT

Texas Instruments

TPS630252YFFT by Texas Instruments

SWITCHING REGULATOR; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$3.450

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,855 parts In-Stock

1+ parts

$3.070

100+ parts

$2.690

1k+ parts

$1.520

10k+ parts

-

36,855

$3.070

$2.690

$1.520

-

DigiKey

USA . 356 parts In-Stock

1+ parts

$3.830

100+ parts

$2.396

1k+ parts

$2.162

10k+ parts

$2.074

356

$3.830

$2.396

$2.162

$2.074

Mouser Electronics

USA . 196 parts In-Stock

1+ parts

$3.830

100+ parts

$2.400

1k+ parts

$2.090

10k+ parts

$2.060

196

$3.830

$2.400

$2.090

$2.060

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$1.900

1k+ parts

$1.700

10k+ parts

$1.600

60

-

$1.900

$1.700

$1.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,024 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

-

4,024

$2.004

-

-

-

Vyrian

USA . 7,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,975

-

-

-

-

Speed Components Ltd

Israel . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 961 parts In-Stock

1+ parts

$1.760

100+ parts

$2.930

1k+ parts

-

10k+ parts

-

961

$1.760

$2.930

-

-

Corphita

USA . 3,212 parts In-Stock

1+ parts

$1.899

100+ parts

-

1k+ parts

-

10k+ parts

-

3,212

$1.899

-

-

-

Parana Technologies

USA . 189 parts In-Stock

1+ parts

$10.773

100+ parts

-

1k+ parts

$11.258

10k+ parts

-

189

$10.773

-

$11.258

-

ChromeModa Solutions

Germany . 2,065 parts In-Stock

1+ parts

$12.105

100+ parts

$9.926

1k+ parts

-

10k+ parts

-

2,065

$12.105

$9.926

-

-

IDEA Electronic Components Group

UK . 372 parts In-Stock

1+ parts

$12.105

100+ parts

$11.500

1k+ parts

$10.894

10k+ parts

-

372

$12.105

$11.500

$10.894

-

Perfect Parts

USA . 271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

271

-

-

-

-

DigiPath Technology Company

USA . 203 parts In-Stock

1+ parts

-

100+ parts

$10.914

1k+ parts

-

10k+ parts

-

203

-

$10.914

-

-

Kepictronics

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

112

-

-

-

-

Technical Specifications

Switching Regulators & Controllers TPS630252YFFT attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN PFM MODE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.3 V

Nominal Input Voltage:

2.8 V

JESD-30 Code:

R-XBGA-B20

JESD-609 Code:

e1

Length:

2.086 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

3.3 V

Nominal Output Voltage:

3.3 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

2500 kHz

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.766 mm

Trade Compliance

TPS630252YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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