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TPS62004DGSG4

Texas Instruments

TPS62004DGSG4 by Texas Instruments

TPS62004DGSG4 by Texas Instruments is a switching regulator with a max output current of 1.6A and a max switching frequency of 1000kHz. It operates in industrial temperature grade range (-40 to 85°C) and is ideal for applications requiring efficient power conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,268 parts In-Stock

1+ parts

-

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3,268

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Digiode

USA . 3,225 parts In-Stock

1+ parts

-

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3,225

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Nova Conductors

Japan . 45 parts In-Stock

1+ parts

-

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45

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 996 parts In-Stock

1+ parts

$1.431

100+ parts

-

1k+ parts

$2.126

10k+ parts

-

996

$1.431

-

$2.126

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ChromeModa Solutions

Germany . 6,688 parts In-Stock

1+ parts

$1.608

100+ parts

$1.319

1k+ parts

-

10k+ parts

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6,688

$1.608

$1.319

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IDEA Electronic Components Group

UK . 1,349 parts In-Stock

1+ parts

$1.608

100+ parts

-

1k+ parts

$1.447

10k+ parts

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1,349

$1.608

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$1.447

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One Stop Electronics

USA . 697 parts In-Stock

1+ parts

$4.500

100+ parts

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697

$4.500

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Ampacity Inc.

Singapore . 570 parts In-Stock

1+ parts

$4.500

100+ parts

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570

$4.500

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AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$11.302

100+ parts

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824

$11.302

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QUARKTWIN TECHNOLOGY LTD

USA . 12,848 parts In-Stock

1+ parts

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12,848

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Corphita

USA . 1,930 parts In-Stock

1+ parts

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1,930

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DigiPath Technology Company

USA . 1,359 parts In-Stock

1+ parts

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100+ parts

$1.450

1k+ parts

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1,359

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$1.450

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Microchip USA

USA . 1,218 parts In-Stock

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1,218

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Overview

Experience superior quality and reliability with the TPS62004DGSG4 by Texas Instruments, a leading manufacturer of cutting-edge electronic components. This switching regulator offers unmatched performance in a compact package, making it ideal for a wide range of applications. Whether you're designing power supplies for industrial equipment or portable devices, this product delivers exceptional value, efficiency, and precision. Trust Texas Instruments to provide the innovative solutions you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product.

Surface Mount: YES

Ease of installation and space-saving design.

Package Shape: SQUARE

Compact design for efficient use of space.

No. of Terminals: 10

Sufficient number of terminals for connectivity options.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high temperature environments.

Minimum Output Voltage: 1.5 V

Provides stable minimum output voltage for various applications.

Control Mode: CURRENT-MODE

Efficient control mechanism for improved performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

High-quality finish for reliable connections.

Maximum Output Voltage: 1.5 V

Limits the output voltage to a safe level for connected devices.

Terminal Position: DUAL

Dual terminal position for flexibility in installation.

Maximum Seated Height: 1.1 mm

Low profile design for compact applications.

Width (mm): 3 mm

Narrow width for space-saving installation.

Other IC type: SWITCHING REGULATOR

Specifically designed for efficient power regulation.

Nominal Input Voltage: 3.6 V

Optimal input voltage for reliable operation.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for specified duration.

Peak Reflow Temperature °C: 260

High temperature tolerance for reflow soldering process.

Length: 3 mm

Compact length for space-constrained installations.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions.

Maximum Switching Frequency: 1000 kHz

High switching frequency for fast response and efficiency.

Maximum Output Current: 1.6 A

Capable of supplying high output current for demanding applications.

Technology: MOS

Utilizes MOS technology for efficient power conversion.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connections.

Control Technique: PULSE WIDTH MODULATION

PWM control technique for precise regulation of output.

Switcher Config: BUCK

Buck switching configuration for step-down voltage regulation.

Terminal Pitch: 0.5 mm

Close terminal pitch for compact and efficient design.

Minimum Input Voltage: 2 V

Supports a wide range of input voltages for versatility.

Nominal Output Voltage: 1.5 V

Stable output voltage for consistent power supply.

Maximum Input Voltage: 5.5 V

Safe maximum input voltage limit for protection of the device.

Technical Specifications

Switching Regulators & Controllers TPS62004DGSG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

PFM CONTROL TECHNIQUE IS ALSO POSSIBLE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Maximum Output Voltage:

1.5 V

Minimum Output Voltage:

1.5 V

Nominal Output Voltage:

1.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1000 kHz

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS62004DGSG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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