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TPS61181RTERG4

Texas Instruments

TPS61181RTERG4 by Texas Instruments

TPS61181RTERG4 by Texas Instruments is a Graphics Display Driver with 16 terminals, operating voltage range of 2.7-3.6V, and max supply current of 2mA. It comes in a square chip carrier package suitable for LED display driver applications in industrial settings with temp range -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,695 parts In-Stock

1+ parts

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7,695

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Digiode

USA . 2,276 parts In-Stock

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-

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2,276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$4.500

100+ parts

-

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1,348

$4.500

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Parana Technologies

USA . 4 parts In-Stock

1+ parts

$6.906

100+ parts

-

1k+ parts

$7.512

10k+ parts

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4

$6.906

-

$7.512

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AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$7.116

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298

$7.116

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DigiPath Technology Company

USA . 1,469 parts In-Stock

1+ parts

$7.605

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1,469

$7.605

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IDEA Electronic Components Group

UK . 407 parts In-Stock

1+ parts

$7.760

100+ parts

-

1k+ parts

$6.984

10k+ parts

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407

$7.760

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$6.984

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ChromeModa Solutions

Germany . 15 parts In-Stock

1+ parts

$7.760

100+ parts

$6.363

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-

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15

$7.760

$6.363

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Microchip USA

USA . 10,270 parts In-Stock

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10,270

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A-Z Elektronik GmbH

Germany . 6,738 parts In-Stock

1+ parts

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6,738

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Corphita

USA . 2,544 parts In-Stock

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2,544

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Overview

Elevate your display experience with the TPS61181RTERG4 by Texas Instruments, a top-tier manufacturer known for delivering quality products. This graphics display driver offers seamless integration and outstanding performance for various applications. With advanced features and reliable functionality, this product provides unmatched value, benefits, and advantages to customers looking for superior display solutions. Upgrade your projects with the TPS61181RTERG4 and experience the difference of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective, making the display driver easy to handle and install.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, including extreme cold.

Maximum Seated Height: 0.8 mm

Low seated height allows for a compact design and integration in space-constrained applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robustness during the assembly process, leading to reliable soldering.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates that the display driver is suitable for non-condensing environments, enhancing its reliability.

Technical Specifications

Graphics Display Drivers TPS61181RTERG4 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

6

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

.001 MHz

Trade Compliance

TPS61181RTERG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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