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TPS563900DAP

Texas Instruments

TPS563900DAP by Texas Instruments

TPS563900DAP by Texas Instruments is a dual switching controller with a max output current of 3.5A and a control technique of pulse width modulation. It operates in industrial temperature grade range (-40 to 85°C) and has a compact package style suitable for various switching regulator applications.

Median Price

$3.237

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,274 parts In-Stock

1+ parts

$3.634

100+ parts

$2.963

1k+ parts

$1.975

10k+ parts

-

13,274

$3.634

$2.963

$1.975

-

Rochester

USA . 92 parts In-Stock

1+ parts

-

100+ parts

$2.840

1k+ parts

$2.540

10k+ parts

$2.390

92

-

$2.840

$2.540

$2.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 696 parts In-Stock

1+ parts

$2.603

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$2.603

-

-

-

Vyrian

USA . 3,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,101

-

-

-

-

Bristol Electronics

USA . 736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

736

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,433 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

-

6,433

$2.330

-

-

-

Semicontronic

India . 6,371 parts In-Stock

1+ parts

$2.330

100+ parts

$2.272

1k+ parts

$2.260

10k+ parts

-

6,371

$2.330

$2.272

$2.260

-

Corphita

USA . 4,545 parts In-Stock

1+ parts

$2.466

100+ parts

-

1k+ parts

-

10k+ parts

-

4,545

$2.466

-

-

-

Corohmni

South Africa . 164 parts In-Stock

1+ parts

$2.740

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$2.740

-

-

-

Component Stockers USA

USA . 133 parts In-Stock

1+ parts

$2.830

100+ parts

-

1k+ parts

-

10k+ parts

-

133

$2.830

-

-

-

Parana Technologies

USA . 1,822 parts In-Stock

1+ parts

$3.166

100+ parts

-

1k+ parts

$3.686

10k+ parts

-

1,822

$3.166

-

$3.686

-

DigiPath Technology Company

USA . 1,229 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

-

10k+ parts

-

1,229

$3.486

-

-

-

IDEA Electronic Components Group

UK . 1,989 parts In-Stock

1+ parts

$3.557

100+ parts

-

1k+ parts

$3.201

10k+ parts

-

1,989

$3.557

-

$3.201

-

ChromeModa Solutions

Germany . 1,348 parts In-Stock

1+ parts

$3.557

100+ parts

$2.917

1k+ parts

-

10k+ parts

-

1,348

$3.557

$2.917

-

-

AZTECH Wire

Italy . 153 parts In-Stock

1+ parts

$10.430

100+ parts

-

1k+ parts

-

10k+ parts

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153

$10.430

-

-

-

Microchip USA

USA . 2,004 parts In-Stock

1+ parts

$25.280

100+ parts

$25.130

1k+ parts

$25.050

10k+ parts

$24.970

2,004

$25.280

$25.130

$25.050

$24.970

Overview

Unleash the power of cutting-edge technology with the TPS563900DAP by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products, and this switching regulator is no exception. Ideal for a wide range of applications, this product offers customers unparalleled value, efficiency, and reliability. Say goodbye to low-quality regulators and hello to the future of power management with the TPS563900DAP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: RECTANGULAR

Optimal shape for fitting on a standard PCB layout, maximizing space efficiency.

No. of Terminals: 32

Plenty of terminals for versatile connectivity options with other components in the circuit.

Maximum Operating Temperature: 85 °C

Ensures stable performance even under high-temperature conditions, suitable for industrial applications.

Minimum Output Voltage: 0.6 V

Allows for precise control and regulation of the output voltage, meeting specific requirements of the application.

Control Mode: CURRENT-MODE

Offers efficient and reliable control over the output current, contributing to overall system stability.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low-temperature environments, expanding the product's usability in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and resistance to corrosion, ensuring reliable connections over time.

Maximum Output Voltage: 15 V

Supports a wide range of output voltage requirements, offering flexibility for different applications.

Terminal Position: DUAL

Dual terminal position allows for more secure connections and better heat dissipation.

Maximum Seated Height: 1.2 mm

Compact size with low profile, suitable for space-constrained designs.

Width (mm): 6.1 mm

Slim width for easy integration into tight spaces on the PCB layout.

Other IC type: DUAL SWITCHING CONTROLLER

Dual control capability enhances performance and reliability, ensuring efficient power regulation.

Nominal Input Voltage: 12 V

Suitable for a wide range of input voltage applications, providing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during assembly, improving manufacturing process.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for reliable solder joints, ensuring long-term durability.

Length: 11 mm

Optimal length for fitting into standard PCB layouts, ensuring easy installation.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance in demanding conditions.

Maximum Switching Frequency: 1600 kHz

High switching frequency allows for efficient power conversion and control, improving overall performance.

Maximum Output Current: 3.5 A

Capable of delivering high output current, making it suitable for powering various components in the circuit.

Terminal Form: GULL WING

Gull-wing terminals provide secure connections and efficient heat dissipation, improving overall reliability.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique ensures accurate and stable regulation of output voltage, enhancing performance.

Switcher Config: BUCK

Buck configuration offers efficient step-down voltage conversion, maximizing power efficiency.

Terminal Pitch: 0.65 mm

Optimal terminal pitch for easy soldering and secure connections on the PCB, improving overall reliability.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly.

Minimum Input Voltage: 4.5 V

Supports a wide range of input voltage levels, providing flexibility for different applications.

No. of Outputs: 2

Dual output capability for powering multiple components, increasing system flexibility.

Maximum Input Voltage: 18 V

Wide input voltage range for compatibility with various power sources, ensuring versatility.

Technical Specifications

Switching Regulators & Controllers TPS563900DAP attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

OUTPUT VOLTAGE IS 0.68 TO 1.95V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

18 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3.5 A

Maximum Output Voltage:

15 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1600 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6.1 mm

Trade Compliance

TPS563900DAP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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