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TPS54383EVM

Texas Instruments

TPS54383EVM by Texas Instruments

TPS54383EVM by Texas Instruments is a DC/DC SMPS Evaluation Board with 2 non-isolated outputs at 3.3V and 5V, each capable of delivering 2A. Operating input voltage range is 9.6V to 13.2V with Buck regulator topology and switching frequency of 310kHz. It is utilized for DC/DC step-down applications in development boards, kits, and programmers.

Median Price

$53.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 27 parts In-Stock

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$49.000

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DigiKey

USA . 1 parts In-Stock

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$58.800

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1

$58.800

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Digiode

USA . 1,325 parts In-Stock

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$46.550

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$46.550

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Vyrian

USA . 8,445 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 739 parts In-Stock

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$21.960

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739

$21.960

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Corphita

USA . 2,015 parts In-Stock

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$44.100

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2,015

$44.100

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Component Stockers USA

USA . 13 parts In-Stock

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$58.210

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13

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ChromeModa Solutions

Germany . 3,018 parts In-Stock

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DigiPath Technology Company

USA . 2,098 parts In-Stock

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IDEA Electronic Components Group

UK . 1,635 parts In-Stock

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Parana Technologies

USA . 1,240 parts In-Stock

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$0.361

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unleash the power of innovation with the TPS54383EVM by Texas Instruments. This top-quality evaluation board offers unmatched performance and reliability for your DC/DC step-down applications. Whether you're looking to optimize efficiency or enhance power management, this versatile tool has you covered. Explore new possibilities in development boards, kits, and programmers with the TPS54383EVM's non-isolated outputs, varied voltage options, and advanced buck regulator topology. Elevate your projects with Texas Instruments' expertise and unlock the full potential of your designs today.

Feature Benefit Bullets

Other Names: 296-31197, TPS54383EVM-ND

Easy to search and order online with multiple part numbers.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Suitable for development and evaluation purposes.

Package: Box

Provides protection and easy storage for the board.

Main Purpose: DC/DC, Step Down

Specifically designed for DC/DC step down applications.

Outputs and Type: 2, Non-Isolated

Provides two non-isolated output options for flexibility in design.

Voltage - Output: 3.3V, 5V

Offers commonly used output voltages for various applications.

Current - Output: 2A, 2A

Delivers sufficient output current for powering components.

Voltage - Input: 9.6V ~ 13.2V

Accepts a wide range of input voltages for versatility.

Regulator Topology: Buck

Efficient buck regulator design for voltage regulation.

Frequency - Switching: 310kHz

High switching frequency for efficient power conversion.

Board Type: Fully Populated

Ready to use with all necessary components installed.

Utilized IC / Part: TPS54383

Features TPS54383 integrated circuit for DC/DC conversion.

Base Product Number: TPS54383

Identifies the core product model for compatibility and replacement.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

No moisture sensitivity concerns for easy storage and handling.

Technical Specifications

Additional Parts TPS54383EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

296-31197
TPS54383EVM-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

2A, 2A

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

310kHz

Supplied Contents:

Board(s)

Voltage - Output:

3.3V, 5V

Board Type:

Fully Populated

Outputs and Type:

2, Non-Isolated

Utilized IC / Part:

TPS54383

Package:

Box

Voltage - Input:

9.6V ~ 13.2V

Base Product Number:

TPS54383

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS54383EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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