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TPS54227EVM-686

Texas Instruments

TPS54227EVM-686 by Texas Instruments

TPS54227EVM-686 by Texas Instruments is a SWIFT™, D-CAP2™ series DC/DC converter evaluation board with 1.05V output voltage and 2A output current. It operates on 4.5V to 18V input voltage, uses Buck regulator topology at 700kHz switching frequency, and is ideal for power supply development/testing applications.

Median Price

$53.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 20 parts In-Stock

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$49.000

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DigiKey

USA . 3 parts In-Stock

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$58.800

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$58.800

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Digiode

USA . 4,684 parts In-Stock

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$46.550

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Vyrian

USA . 2,387 parts In-Stock

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Semicontronic

India . 12 parts In-Stock

1+ parts

$41.650

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$40.609

1k+ parts

$40.400

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12

$41.650

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$40.400

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Corphita

USA . 1,123 parts In-Stock

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$44.100

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$44.100

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Corohmni

South Africa . 197 parts In-Stock

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$49.000

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IDEA Electronic Components Group

UK . 2,050 parts In-Stock

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Parana Technologies

USA . 1,473 parts In-Stock

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$0.615

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DigiPath Technology Company

USA . 1,298 parts In-Stock

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ChromeModa Solutions

Germany . 39 parts In-Stock

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Perfect Parts

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Overview

Looking to power your DC/DC converter efficiently and reliably? Look no further than the TPS54227EVM-686 by Texas Instruments. As a leader in the semiconductor industry, Texas Instruments guarantees top-notch quality and performance. This evaluation board is perfect for testing out the SWIFT™ and D-CAP2™ series regulators, offering 1.05V output at 2A current. With a wide input voltage range of 4.5V to 18V and a buck regulator topology, this board is ideal for a variety of applications. Trust Texas Instruments for superior products that deliver exceptional value and benefits to customers.

Feature Benefit Bullets

Other Names

Easy to identify and locate product in inventory or online listings.

Category

Designed for development and evaluation purposes, suitable for testing and prototyping.

Package

Bulk packaging for convenience and cost-effectiveness.

Main Purpose

Specifically designed for DC/DC conversion applications.

Voltage - Output

Precise output voltage of 1.05V for reliable power supply.

Current - Output

Capable of providing up to 2A output current, suitable for various devices and applications.

Voltage - Input

Wide input voltage range of 4.5V to 18V for flexibility in different scenarios.

Regulator Topology

Efficient buck regulator topology for step-down voltage conversion.

Frequency - Switching

High switching frequency of 700kHz for fast response and reduced size of external components.

Board Type

Fully populated evaluation board for immediate testing and evaluation.

Supplied Contents

Includes necessary board(s) for easy setup and testing.

Utilized IC / Part

Utilizes TPS54227 IC for reliable and efficient performance.

Base Product Number

Based on the well-known TPS54227 series for proven performance and compatibility.

Moisture Sensitivity Level (MSL)

MSL 1 indicates unlimited exposure to moisture, ensuring long-term reliability.

Technical Specifications

Additional Parts TPS54227EVM-686 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC Converter

Other Names:

296-29084
TPS54227EVM686

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

2A

Standard Package:

1

Series:

SWIFT™, D-CAP2™

Regulator Topology:

Buck

Frequency - Switching:

700kHz

Supplied Contents:

Board(s)

Voltage - Output:

1.05V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

TPS54227

Package:

Bulk

Voltage - Input:

4.5V ~ 18V

Base Product Number:

TPS54227

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS54227EVM-686 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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