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TPS3851G18SDRBT

Texas Instruments

TPS3851G18SDRBT by Texas Instruments

TPS3851G18SDRBT by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 125°C. It has a nominal voltage of 5V and threshold voltage of +1.8V, suitable for automotive applications due to its small outline package and low supply current of 0.019mA.

Median Price

$2.044

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 134 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

134

$1.080

-

-

-

Texas Instruments

USA . 63,140 parts In-Stock

1+ parts

$1.859

100+ parts

$1.536

1k+ parts

$0.830

10k+ parts

-

63,140

$1.859

$1.536

$0.830

-

DigiKey

USA . 29 parts In-Stock

1+ parts

$2.230

100+ parts

$1.347

1k+ parts

$1.202

10k+ parts

$1.117

29

$2.230

$1.347

$1.202

$1.117

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$2.230

100+ parts

$1.350

1k+ parts

$1.160

10k+ parts

$1.110

3

$2.230

$1.350

$1.160

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,589 parts In-Stock

1+ parts

$1.766

100+ parts

-

1k+ parts

-

10k+ parts

-

4,589

$1.766

-

-

-

Vyrian

USA . 7,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,765

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 20,933 parts In-Stock

1+ parts

$1.580

100+ parts

-

1k+ parts

-

10k+ parts

-

20,933

$1.580

-

-

-

Semicontronic

India . 20,837 parts In-Stock

1+ parts

$1.580

100+ parts

$1.540

1k+ parts

$1.533

10k+ parts

-

20,837

$1.580

$1.540

$1.533

-

Corphita

USA . 3,574 parts In-Stock

1+ parts

$1.673

100+ parts

-

1k+ parts

-

10k+ parts

-

3,574

$1.673

-

-

-

Corohmni

South Africa . 91 parts In-Stock

1+ parts

$1.859

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$1.859

-

-

-

Parana Technologies

USA . 311 parts In-Stock

1+ parts

$6.447

100+ parts

-

1k+ parts

$7.190

10k+ parts

-

311

$6.447

-

$7.190

-

DigiPath Technology Company

USA . 319 parts In-Stock

1+ parts

$7.099

100+ parts

$6.531

1k+ parts

-

10k+ parts

-

319

$7.099

$6.531

-

-

ChromeModa Solutions

Germany . 2,339 parts In-Stock

1+ parts

$7.244

100+ parts

$5.940

1k+ parts

-

10k+ parts

-

2,339

$7.244

$5.940

-

-

IDEA Electronic Components Group

UK . 2,159 parts In-Stock

1+ parts

$7.244

100+ parts

-

1k+ parts

$6.520

10k+ parts

-

2,159

$7.244

-

$6.520

-

Overview

Unleash the power of reliable and efficient power management with the TPS3851G18SDRBT by Texas Instruments. Crafted with precision and expertise, this small outline, square package IC is designed to withstand extreme temperatures and automotive conditions. Perfect for a wide range of applications, this power supply management circuit offers customers peace of mind with its durability, high performance, and low supply current. Experience the quality and value that only Texas Instruments can provide with the TPS3851G18SDRBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product resistant to damage and easy to handle during assembly.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving time and effort in the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

Operates at a common and stable 5V supply voltage, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures up to 125°C, ensuring reliable performance even in challenging conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures down to -40°C, making it suitable for a variety of environments.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline and thin profile design with a heat sink ensures efficient heat dissipation, leading to improved overall performance and longevity.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold finish on terminals provides excellent conductivity and corrosion resistance, enhancing the product's durability and longevity.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive-grade standards, ensuring reliability and performance in automotive applications where temperature and environmental conditions can vary.

Maximum Supply Current (Isup): 0.019 mA

Low supply current consumption of only 0.019 mA helps conserve power and improves efficiency in power management operations.

Technical Specifications

Power Management ICs TPS3851G18SDRBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

THRESHOLD VOLTAGE IS 1.8V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.019 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.8V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3851G18SDRBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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