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TPS3808G30DBVTG4

Texas Instruments

TPS3808G30DBVTG4 by Texas Instruments

TPS3808G30DBVTG4 by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V and operating temperature range from -40 to 125°C. It features a small outline package style, suitable for automotive applications requiring power supply support circuits. The IC has dual terminals, gull wing form, and shrink pitch package shape for compact designs in surface mount configurations.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.050

10k+ parts

$0.910

145

-

-

$1.050

$0.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

71

$1.330

-

-

-

Vyrian

USA . 8,897 parts In-Stock

1+ parts

-

100+ parts

-

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8,897

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-

-

-

Digiode

USA . 4,035 parts In-Stock

1+ parts

-

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-

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4,035

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 145 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

145

$0.890

-

-

-

Semicontronic

India . 101 parts In-Stock

1+ parts

$0.890

100+ parts

$0.868

1k+ parts

$0.863

10k+ parts

-

101

$0.890

$0.868

$0.863

-

Corohmni

South Africa . 4 parts In-Stock

1+ parts

$1.330

100+ parts

-

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-

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-

4

$1.330

-

-

-

Continental Prestige Electronics

USA . 6,577 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

$1.303

6,577

$1.330

-

-

$1.303

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

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2,000

$1.330

-

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Argo Parts USA

USA . 1,742 parts In-Stock

1+ parts

$1.330

100+ parts

-

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1,742

$1.330

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$1.370

100+ parts

$1.301

1k+ parts

$1.301

10k+ parts

-

20

$1.370

$1.301

$1.301

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$5.412

100+ parts

-

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664

$5.412

-

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Parana Technologies

USA . 1,648 parts In-Stock

1+ parts

$18.180

100+ parts

-

1k+ parts

$18.320

10k+ parts

-

1,648

$18.180

-

$18.320

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ChromeModa Solutions

Germany . 689 parts In-Stock

1+ parts

$20.427

100+ parts

$16.750

1k+ parts

-

10k+ parts

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689

$20.427

$16.750

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IDEA Electronic Components Group

UK . 251 parts In-Stock

1+ parts

$20.427

100+ parts

$19.406

1k+ parts

$18.384

10k+ parts

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251

$20.427

$19.406

$18.384

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Corphita

USA . 4,991 parts In-Stock

1+ parts

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4,991

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DigiPath Technology Company

USA . 2,020 parts In-Stock

1+ parts

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100+ parts

$18.417

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2,020

-

$18.417

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-

Microchip USA

USA . 1,965 parts In-Stock

1+ parts

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1,965

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

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560

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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100

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Overview

Discover the innovative TPS3808G30DBVTG4 by Texas Instruments, a top-tier Power Management IC designed to optimize efficiency and performance. With a reputation for excellence, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for automotive applications, this small outline, low profile package offers unrivaled reliability and precision. Trust in Texas Instruments to provide exceptional quality and value with the TPS3808G30DBVTG4, setting new benchmarks in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the Power Management IC, making it suitable for various environments.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal voltage level for efficient power management and performance.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature conditions without compromising reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures good conductivity and corrosion resistance for long-term use.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

Technical Specifications

Power Management ICs TPS3808G30DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 2.79V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/6.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0057 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.79V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3808G30DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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