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TPS3808G25DRVTG4

Texas Instruments

TPS3808G25DRVTG4 by Texas Instruments

TPS3808G25DRVTG4 by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures ranging from -40 to 125°C. With a max supply voltage of 6.5V and low supply current of 0.006mA, it offers reliable power supply support in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,780 parts In-Stock

1+ parts

-

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1k+ parts

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4,780

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Chip Stock

USA . 3,820 parts In-Stock

1+ parts

-

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3,820

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Vyrian

USA . 2,156 parts In-Stock

1+ parts

-

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2,156

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 153 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

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10k+ parts

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153

$3.500

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One Stop Electronics

USA . 1,342 parts In-Stock

1+ parts

$4.500

100+ parts

-

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10k+ parts

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1,342

$4.500

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Semicontronic

India . 182 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

182

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$7.700

100+ parts

-

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595

$7.700

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Parana Technologies

USA . 371 parts In-Stock

1+ parts

$15.927

100+ parts

-

1k+ parts

$16.281

10k+ parts

-

371

$15.927

-

$16.281

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ChromeModa Solutions

Germany . 2,232 parts In-Stock

1+ parts

$17.895

100+ parts

$14.674

1k+ parts

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2,232

$17.895

$14.674

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IDEA Electronic Components Group

UK . 1,189 parts In-Stock

1+ parts

$17.895

100+ parts

$17.000

1k+ parts

$16.106

10k+ parts

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1,189

$17.895

$17.000

$16.106

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Corphita

USA . 3,346 parts In-Stock

1+ parts

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3,346

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Microchip USA

USA . 1,147 parts In-Stock

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1,147

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DigiPath Technology Company

USA . 294 parts In-Stock

1+ parts

-

100+ parts

$16.134

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294

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$16.134

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Corohmni

South Africa . 239 parts In-Stock

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239

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Overview

Unlock the full potential of your power management needs with the TPS3808G25DRVTG4 by Texas Instruments. Crafted with precision and reliability, this Power Management IC offers unparalleled performance in a compact and durable package. Perfect for automotive applications, this innovative product guarantees seamless integration and efficient power supply support circuitry. Elevate your project with the quality and value that only Texas Instruments can provide. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in reducing the overall weight of the product, making it a good choice for portable applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with a wide range of electronic devices, making this product versatile and widely applicable.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high heat environments, ensuring reliable performance in various conditions.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances thermal management and allows for space-saving design implementation, making this product ideal for compact devices.

Minimum Supply Voltage (Vsup): 1.8 V

The minimum supply voltage of 1.8 V ensures efficient power utilization and compatibility with low-power applications, making this product energy-efficient.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that this product can withstand harsh automotive environments, making it a reliable choice for automotive applications.

Maximum Supply Current (Isup): 0.006 mA

The low maximum supply current of 0.006 mA indicates that this product consumes minimal power, contributing to energy efficiency and extending battery life in battery-powered devices.

Technical Specifications

Power Management ICs TPS3808G25DRVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 2.33V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/6.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.33V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

TPS3808G25DRVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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