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TPS3808G25DRVRG4

Texas Instruments

TPS3808G25DRVRG4 by Texas Instruments

TPS3808G25DRVRG4 by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures ranging from -40 to 125°C. With surface mount capability and low supply current of 0.006mA, it offers reliable power supply support in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,989 parts In-Stock

1+ parts

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3,989

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Digiode

USA . 2,751 parts In-Stock

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2,751

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,125 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,125

$1.500

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One Stop Electronics

USA . 354 parts In-Stock

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$2.500

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354

$2.500

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Parana Technologies

USA . 2,362 parts In-Stock

1+ parts

$3.435

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$3.959

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2,362

$3.435

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$3.959

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DigiPath Technology Company

USA . 286 parts In-Stock

1+ parts

$3.782

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286

$3.782

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ChromeModa Solutions

Germany . 2,537 parts In-Stock

1+ parts

$3.859

100+ parts

$3.164

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2,537

$3.859

$3.164

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IDEA Electronic Components Group

UK . 763 parts In-Stock

1+ parts

$3.859

100+ parts

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$3.473

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763

$3.859

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$3.473

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AZTECH Wire

Italy . 276 parts In-Stock

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$8.375

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276

$8.375

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Corohmni

South Africa . 636 parts In-Stock

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$21.576

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636

$21.576

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Continental Prestige Electronics

USA . 4,981 parts In-Stock

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4,981

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Argo Parts USA

USA . 1,240 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Microchip USA

USA . 930 parts In-Stock

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930

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Corphita

USA . 781 parts In-Stock

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781

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Overview

Elevate your power management game with the TPS3808G25DRVRG4 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable and efficient power management ICs that cater to a wide range of applications. This small outline, heat sink package offers a nominal supply voltage of 3.3V, making it ideal for automotive use. With a terminal finish of nickel palladium gold and a low profile, this IC provides maximum performance in a compact design. Experience the value and benefits of Texas Instruments' cutting-edge technology with the TPS3808G25DRVRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the Power Management IC, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the Power Management IC onto circuit boards, saving time and effort in the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

With a stable nominal supply voltage of 3.3 V, this Power Management IC is suitable for a wide range of applications and can deliver consistent power output.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in challenging thermal environments, making this Power Management IC ideal for industrial and automotive applications.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade means this Power Management IC is designed to withstand the temperature fluctuations and harsh conditions typical in automotive environments, ensuring robust performance in vehicles.

Technical Specifications

Power Management ICs TPS3808G25DRVRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 2.33V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/6.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.33V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

TPS3808G25DRVRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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