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TPS3808G18DBVTG4

Texas Instruments

TPS3808G18DBVTG4 by Texas Instruments

TPS3808G18DBVTG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 1.7-6.5V supply range, and +1.67V threshold voltage. It is used in automotive applications due to its small outline package, dual terminal position, and low profile design for power supply support circuits.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.050

10k+ parts

$0.910

358

-

-

$1.050

$0.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.998

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$0.998

-

-

-

Chip Stock

USA . 230,550 parts In-Stock

1+ parts

-

100+ parts

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230,550

-

-

-

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Vyrian

USA . 4,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,992

-

-

-

-

Digiode

USA . 2,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,290

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 177 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

177

$0.890

-

-

-

Argo Parts USA

USA . 2,904 parts In-Stock

1+ parts

$0.998

100+ parts

-

1k+ parts

-

10k+ parts

-

2,904

$0.998

-

-

-

Continental Prestige Electronics

USA . 2,750 parts In-Stock

1+ parts

$0.998

100+ parts

-

1k+ parts

-

10k+ parts

$0.978

2,750

$0.998

-

-

$0.978

Parana Technologies

USA . 536 parts In-Stock

1+ parts

$11.930

100+ parts

-

1k+ parts

$12.335

10k+ parts

-

536

$11.930

-

$12.335

-

DigiPath Technology Company

USA . 1,668 parts In-Stock

1+ parts

$13.137

100+ parts

$12.086

1k+ parts

-

10k+ parts

-

1,668

$13.137

$12.086

-

-

ChromeModa Solutions

Germany . 6,097 parts In-Stock

1+ parts

$13.405

100+ parts

$10.992

1k+ parts

-

10k+ parts

-

6,097

$13.405

$10.992

-

-

IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$13.405

100+ parts

$12.735

1k+ parts

$12.064

10k+ parts

-

2,329

$13.405

$12.735

$12.064

-

Corohmni

South Africa . 23 parts In-Stock

1+ parts

$15.409

100+ parts

-

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23

$15.409

-

-

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AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$17.122

100+ parts

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298

$17.122

-

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Corphita

USA . 4,834 parts In-Stock

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4,834

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Microchip USA

USA . 2,851 parts In-Stock

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2,851

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Perfect Parts

USA . 665 parts In-Stock

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665

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.978

1k+ parts

$0.948

10k+ parts

$0.928

50

-

$0.978

$0.948

$0.928

Overview

Elevate your power management game with the TPS3808G18DBVTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in all their products. This Power Management IC is perfect for a wide range of applications, offering superior performance and efficiency. With a nominal supply voltage of 3.3V and a wide operating temperature range from -40°C to 125°C, this IC provides the stability and durability you need. Say goodbye to power interruptions and hello to seamless operations with the TPS3808G18DBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic devices, making this IC versatile and compatible.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this IC is suitable for use in a wide range of environments, including those with colder temperatures.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the IC can withstand heat and operate reliably even in demanding conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Nickel/Palladium/Gold provides excellent conductivity and corrosion resistance, leading to a longer lifespan and improved performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets the specific requirements and standards for use in vehicles, ensuring reliability and durability.

Technical Specifications

Power Management ICs TPS3808G18DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 1.67V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/6.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0057 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.67V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3808G18DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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