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TPS3307-25DG4

Texas Instruments

TPS3307-25DG4 by Texas Instruments

TPS3307-25DG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and +1.25/2.25/2.93V threshold voltages. It is used in industrial applications for power supply support circuits due to its CMOS technology and adjustable threshold feature.

Median Price

$1.232

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 11,500 parts In-Stock

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Digiode

USA . 4,692 parts In-Stock

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Vyrian

USA . 3,672 parts In-Stock

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Speed Components Ltd

Israel . 490 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 170 parts In-Stock

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Bristol Electronics

USA . 64 parts In-Stock

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Microfarads

USA . 62 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 672 parts In-Stock

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$0.500

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672

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Parana Technologies

USA . 176 parts In-Stock

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$5.537

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$6.301

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ChromeModa Solutions

Germany . 1,547 parts In-Stock

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$6.221

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$5.101

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IDEA Electronic Components Group

UK . 1,379 parts In-Stock

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$6.221

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$5.599

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AZTECH Wire

Italy . 639 parts In-Stock

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$19.213

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Microchip USA

USA . 2,517 parts In-Stock

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DigiPath Technology Company

USA . 2,220 parts In-Stock

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Corphita

USA . 862 parts In-Stock

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Perfect Parts

USA . 381 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 170 parts In-Stock

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Glotronic Ltd.

UK . 136 parts In-Stock

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Overview

Discover the TPS3307-25DG4 from Texas Instruments, a high-quality Power Management IC designed to provide reliable and efficient power supply support. With its advanced technology and industrial-grade temperature grade, this product offers unmatched performance and durability in various applications. Whether you need power management for automotive, industrial, or consumer electronics, the TPS3307-25DG4 delivers exceptional value, benefits, and advantages that will exceed your expectations. Trust Texas Instruments for top-notch quality and innovation in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is suitable for a wide range of electronic devices, making this power management IC versatile.

Package Style: SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact electronic designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this power management IC is reliable even in harsh environments.

Technology: CMOS

The CMOS technology used in this power management IC provides low power consumption and efficient performance.

Adjustable Threshold: YES

The ability to adjust the threshold voltage makes this power management IC customizable to suit different application requirements.

Technical Specifications

Power Management ICs TPS3307-25DG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.93V; MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.25,2.25,2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS3307-25DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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