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TPS3306-33DGKR

Texas Instruments

TPS3306-33DGKR by Texas Instruments

TPS3306-33DGKR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features dual terminal position, gull wing form, and operates in temperatures ranging from -40 to 85°C. With a small outline package style and peak reflow temperature of 260°C, it offers efficient power supply management for various electronic devices.

Median Price

$2.034

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,017 parts In-Stock

1+ parts

$2.034

100+ parts

$1.782

1k+ parts

$1.007

10k+ parts

-

18,017

$2.034

$1.782

$1.007

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.007

-

-

-

Digiode

USA . 4,957 parts In-Stock

1+ parts

$1.932

100+ parts

-

1k+ parts

-

10k+ parts

-

4,957

$1.932

-

-

-

Vyrian

USA . 7,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,559

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,167 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

$0.987

6,167

$1.007

-

-

$0.987

Argo Parts USA

USA . 3,933 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

-

10k+ parts

-

3,933

$1.007

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.007

100+ parts

-

1k+ parts

$0.957

10k+ parts

$0.937

50

$1.007

-

$0.957

$0.937

Parana Technologies

USA . 425 parts In-Stock

1+ parts

$1.097

100+ parts

-

1k+ parts

$1.936

10k+ parts

-

425

$1.097

-

$1.936

-

DigiPath Technology Company

USA . 617 parts In-Stock

1+ parts

$1.208

100+ parts

$1.112

1k+ parts

-

10k+ parts

-

617

$1.208

$1.112

-

-

ChromeModa Solutions

Germany . 5,395 parts In-Stock

1+ parts

$1.233

100+ parts

$1.011

1k+ parts

-

10k+ parts

-

5,395

$1.233

$1.011

-

-

IDEA Electronic Components Group

UK . 642 parts In-Stock

1+ parts

$1.233

100+ parts

-

1k+ parts

$1.110

10k+ parts

-

642

$1.233

-

$1.110

-

Ampacity Inc.

Singapore . 17,528 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

17,528

$1.730

-

-

-

Corphita

USA . 3,780 parts In-Stock

1+ parts

$1.831

100+ parts

-

1k+ parts

-

10k+ parts

-

3,780

$1.831

-

-

-

AZTECH Wire

Italy . 796 parts In-Stock

1+ parts

$18.740

100+ parts

-

1k+ parts

-

10k+ parts

-

796

$18.740

-

-

-

Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 8,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,176

-

-

-

-

Overview

Experience unparalleled quality and reliability with the TPS3306-33DGKR by Texas Instruments, a leading manufacturer in the Power Management ICs category. This versatile product is designed to provide seamless power supply management for a wide range of applications. With a compact design and industrial-grade temperature tolerance, this power management circuit offers unmatched performance and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your power supply needs with precision and innovation. Elevate your projects with the TPS3306-33DGKR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability for the Power Management IC, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage allows for compatibility with a wide range of electronic devices and systems.

No. of Terminals: 8

Having 8 terminals increases the flexibility and functionality of the Power Management IC for connecting to multiple components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width (mm): 3 mm

The small width of 3mm makes the Power Management IC compact and ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the Power Management IC can operate in harsh industrial environments without any issues.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6V provides flexibility for powering a variety of electronic components and systems.

Technical Specifications

Power Management ICs TPS3306-33DGKR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55,2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3306-33DGKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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