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TPS3306-25DGKG4

Texas Instruments

TPS3306-25DGKG4 by Texas Instruments

TPS3306-25DGKG4 by Texas Instruments is a Power Management IC with 3/5 V supplies, 8 terminals, and +2.93/2.25V threshold voltage. It is used in industrial applications for power supply management circuits due to its small outline package and wide operating temperature range of -40 to 85°C.

Median Price

$3.600

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 32 parts In-Stock

1+ parts

$3.600

100+ parts

$2.640

1k+ parts

$2.240

10k+ parts

$1.680

32

$3.600

$2.640

$2.240

$1.680

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$2.120

-

-

-

Digiode

USA . 1,327 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$3.420

-

-

-

Vyrian

USA . 5,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,211

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,974 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

-

10k+ parts

$2.078

3,974

$2.120

-

-

$2.078

Argo Parts USA

USA . 3,020 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

-

10k+ parts

-

3,020

$2.120

-

-

-

Ampacity Inc.

Singapore . 32 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

-

10k+ parts

-

32

$3.060

-

-

-

Semicontronic

India . 32 parts In-Stock

1+ parts

$3.060

100+ parts

$2.984

1k+ parts

$2.968

10k+ parts

-

32

$3.060

$2.984

$2.968

-

Corphita

USA . 2,947 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,947

$3.240

-

-

-

Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

$7.978

100+ parts

-

1k+ parts

$8.558

10k+ parts

-

2,100

$7.978

-

$8.558

-

ChromeModa Solutions

Germany . 5,333 parts In-Stock

1+ parts

$8.964

100+ parts

$7.350

1k+ parts

-

10k+ parts

-

5,333

$8.964

$7.350

-

-

IDEA Electronic Components Group

UK . 2,050 parts In-Stock

1+ parts

$8.964

100+ parts

$8.516

1k+ parts

$8.068

10k+ parts

-

2,050

$8.964

$8.516

$8.068

-

AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$10.737

100+ parts

-

1k+ parts

-

10k+ parts

-

368

$10.737

-

-

-

Microchip USA

USA . 2,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

-

-

-

-

DigiPath Technology Company

USA . 690 parts In-Stock

1+ parts

-

100+ parts

$8.082

1k+ parts

-

10k+ parts

-

690

-

$8.082

-

-

Overview

Experience top-notch power management with the TPS3306-25DGKG4 by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers reliable Power Management ICs that cater to a wide range of applications. With a compact design and durable construction, this product ensures optimal performance in industrial settings. Trust in Texas Instruments to provide you with efficient solutions that meet your power supply needs, offering unparalleled value and benefits for all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on the circuit board, particularly in compact designs.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is ideal for powering a wide range of electronic devices while maintaining efficiency.

Power Supplies (V): 3/5

This product can support both 3V and 5V power supplies, offering flexibility in choosing compatible power sources.

No. of Terminals: 8

With 8 terminals, this product allows for multiple connections, enabling complex power management configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package offer space-saving benefits, perfect for tight layouts.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable operation in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position offers redundancy and flexibility in connecting external components, enhancing system robustness.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm minimizes the overall profile of the product, making it suitable for slim devices.

Width (mm): 3 mm

The compact width of 3mm allows for easy integration into space-constrained designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

The power supply management circuitry enhances energy efficiency and protects connected devices from voltage fluctuations.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures compatibility with a wide range of power sources, increasing overall versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables secure solder joints for reliable performance under thermal stress.

Length: 3 mm

The length of 3mm offers a compact form factor, suitable for applications where space is at a premium.

Nominal Threshold Voltage (V): +2.93,2.25V

The nominal threshold voltage settings of +2.93V and 2.25V provide precise control over power delivery, minimizing the risk of overvoltage.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation across a wide range of temperature conditions, making it suitable for industrial applications.

Maximum Supply Current (Isup): 0.04 mA

The low maximum supply current of 0.04mA helps minimize power consumption, ideal for battery-operated devices.

No. of Channels: 2

With 2 channels, this product can manage multiple power sources or loads simultaneously, enhancing system flexibility.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process, ensuring secure connections during assembly.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting on the PCB, optimizing space utilization.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V provides compatibility with a wide range of power sources, making it versatile for different applications.

Technical Specifications

Power Management ICs TPS3306-25DGKG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93,2.25V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS3306-25DGKG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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