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TPS3124J12DBVR

Texas Instruments

TPS3124J12DBVR by Texas Instruments

TPS3124J12DBVR by Texas Instruments is a Power Management IC with 1.2V supply voltage, 5 terminals, and -40 to 85°C operating temperature range. It is ideal for industrial applications requiring low profile components in a small outline package.

Median Price

$1.373

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,000 parts In-Stock

1+ parts

$0.920

100+ parts

$0.900

1k+ parts

$0.880

10k+ parts

-

8,000

$0.920

$0.900

$0.880

-

Texas Instruments

USA . 32,349 parts In-Stock

1+ parts

$1.826

100+ parts

$1.508

1k+ parts

$0.815

10k+ parts

-

32,349

$1.826

$1.508

$0.815

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,755 parts In-Stock

1+ parts

$1.074

100+ parts

-

1k+ parts

-

10k+ parts

-

1,755

$1.074

-

-

-

Vyrian

USA . 7,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,424

-

-

-

-

Rebound Electronics

UK . 975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

975

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,524 parts In-Stock

1+ parts

$1.017

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

$1.017

-

-

-

AZTECH Wire

Italy . 739 parts In-Stock

1+ parts

$8.050

100+ parts

-

1k+ parts

-

10k+ parts

-

739

$8.050

-

-

-

Parana Technologies

USA . 1,249 parts In-Stock

1+ parts

$9.414

100+ parts

$874.272

1k+ parts

$8.473

10k+ parts

-

1,249

$9.414

$874.272

$8.473

-

DigiPath Technology Company

USA . 1,393 parts In-Stock

1+ parts

$10.366

100+ parts

$9.537

1k+ parts

-

10k+ parts

-

1,393

$10.366

$9.537

-

-

ChromeModa Solutions

Germany . 2,883 parts In-Stock

1+ parts

$10.578

100+ parts

$8.674

1k+ parts

-

10k+ parts

-

2,883

$10.578

$8.674

-

-

IDEA Electronic Components Group

UK . 1,539 parts In-Stock

1+ parts

$10.578

100+ parts

$10.049

1k+ parts

$9.520

10k+ parts

-

1,539

$10.578

$10.049

$9.520

-

Overview

Experience superior power management with the TPS3124J12DBVR by Texas Instruments. Known for their top-quality products, Texas Instruments delivers cutting-edge solutions in the Power Management ICs category. This small outline, low profile package offers a range of benefits, from a wide operating temperature range to a nickel/palladium/gold terminal finish. Perfect for industrial applications, this power supply management circuit ensures reliable performance and efficiency. Trust Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation, making the product suitable for a variety of environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort in assembly.

Nominal Supply Voltage (Vsup): 1.2 V

Efficiently handles power supply at 1.2V, ensuring stable performance.

No. of Terminals: 5

Offers enough terminals for connectivity, facilitating integration into larger systems.

Maximum Operating Temperature: 85 °C

Capability to operate at high temperatures without compromising functionality.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold temperatures, expanding usage scenarios.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures reliable connections and corrosion resistance for prolonged product lifespan.

Width (mm): 1.6 mm

Compact size allows for efficient use of space in electronic devices.

Minimum Supply Voltage (Vsup): 0.85 V

Supports a low minimum supply voltage, enabling operation in energy-efficient applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments where temperature variations are common.

Maximum Supply Current (Isup): 0.03 mA

Low supply current requirement helps in energy conservation and heat management.

Terminal Form: GULL WING

Facilitates easy soldering and improves mechanical strength for reliable connections.

Maximum Supply Voltage (Vsup): 3.3 V

Supports a wide range of supply voltages, increasing compatibility with various systems.

Technical Specifications

Power Management ICs TPS3124J12DBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.03 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

.85 V

Nominal Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.08V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3124J12DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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