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TPS2069CDGN

Texas Instruments

TPS2069CDGN by Texas Instruments

TPS2069CDGN by Texas Instruments is a small outline, heat sink IC with 8 terminals and a nominal voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and is suitable for analog circuit applications. The package material is plastic/epoxy, making it surface mountable with a square shape and gull wing terminal form.

Median Price

$0.710

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,096 parts In-Stock

1+ parts

$0.620

100+ parts

$0.610

1k+ parts

$0.600

10k+ parts

-

35,096

$0.620

$0.610

$0.600

-

Texas Instruments

USA . 324,320 parts In-Stock

1+ parts

$0.710

100+ parts

$0.586

1k+ parts

$0.317

10k+ parts

-

324,320

$0.710

$0.586

$0.317

-

Mouser Electronics

USA . 5,795 parts In-Stock

1+ parts

$1.080

100+ parts

$0.597

1k+ parts

$0.552

10k+ parts

$0.504

5,795

$1.080

$0.597

$0.552

$0.504

DigiKey

USA . 2,569 parts In-Stock

1+ parts

$1.080

100+ parts

$0.630

1k+ parts

$0.552

10k+ parts

$0.503

2,569

$1.080

$0.630

$0.552

$0.503

Arrow

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.424

2,080

-

-

-

$0.424

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$0.504

-

-

-

Digiode

USA . 290 parts In-Stock

1+ parts

$0.589

100+ parts

-

1k+ parts

-

10k+ parts

-

290

$0.589

-

-

-

Vyrian

USA . 73,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

73,252

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 73,215 parts In-Stock

1+ parts

$0.313

100+ parts

-

1k+ parts

-

10k+ parts

-

73,215

$0.313

-

-

-

Continental Prestige Electronics

USA . 3,536 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

$0.494

3,536

$0.504

-

-

$0.494

Argo Parts USA

USA . 926 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

$0.489

926

$0.504

-

-

$0.489

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.504

100+ parts

$0.494

1k+ parts

$0.479

10k+ parts

$0.469

50

$0.504

$0.494

$0.479

$0.469

Advanced Electronics

New Zealand . 96 parts In-Stock

1+ parts

$0.514

100+ parts

$0.514

1k+ parts

$0.514

10k+ parts

-

96

$0.514

$0.514

$0.514

-

Corphita

USA . 1,021 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

-

10k+ parts

-

1,021

$0.558

-

-

-

Parana Technologies

USA . 1,793 parts In-Stock

1+ parts

$3.011

100+ parts

-

1k+ parts

$3.518

10k+ parts

-

1,793

$3.011

-

$3.518

-

DigiPath Technology Company

USA . 2,171 parts In-Stock

1+ parts

$3.315

100+ parts

-

1k+ parts

-

10k+ parts

-

2,171

$3.315

-

-

-

ChromeModa Solutions

Germany . 5,947 parts In-Stock

1+ parts

$3.383

100+ parts

$2.774

1k+ parts

-

10k+ parts

-

5,947

$3.383

$2.774

-

-

IDEA Electronic Components Group

UK . 2,333 parts In-Stock

1+ parts

$3.383

100+ parts

-

1k+ parts

$3.045

10k+ parts

-

2,333

$3.383

-

$3.045

-

Corohmni

South Africa . 65 parts In-Stock

1+ parts

$5.833

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$5.833

-

-

-

Kepictronics

USA . 388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

388

-

-

-

-

Overview

Elevate your electronic designs with the TPS2069CDGN by Texas Instruments. Known for their high-quality manufacturing, Texas Instruments delivers superior products in the Other Function Semiconductors category. The TPS2069CDGN is a versatile solution for a wide range of applications, offering reliability and efficiency. With its small outline package and industrial temperature grade, this product provides customers with exceptional value and performance. Enhance your projects with the TPS2069CDGN and experience the benefits of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the components inside, ensuring reliable performance.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 5 V

Suitable for a wide range of applications and compatible with many standard power sources.

Maximum Operating Temperature: 85 °C

Allows the product to withstand higher temperatures, making it suitable for industrial environments.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides excellent conductivity and corrosion resistance for reliable connections.

Technical Specifications

Other Function Semiconductors TPS2069CDGN attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2069CDGN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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