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TPS2051BEVM

Texas Instruments

TPS2051BEVM by Texas Instruments

TPS2051BEVM by Texas Instruments is a Power Distribution Switch Evaluation Board for TPS2051B IC. It operates with 2.7V to 5.5V input voltage, offering short-circuit, thermal, and undervoltage protection. Ideal for power management applications requiring reliable load switching capabilities.

Median Price

$49.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22 parts In-Stock

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$49.000

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Digiode

USA . 4,757 parts In-Stock

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$46.550

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$46.550

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Vyrian

USA . 5,580 parts In-Stock

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5,580

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AZTECH Wire

Italy . 1,060 parts In-Stock

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$17.490

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$17.490

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Ampacity Inc.

Singapore . 13 parts In-Stock

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$41.650

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13

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Semicontronic

India . 13 parts In-Stock

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$41.650

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$40.609

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$40.400

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13

$41.650

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$40.400

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Corphita

USA . 907 parts In-Stock

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$44.100

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907

$44.100

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Corohmni

South Africa . 226 parts In-Stock

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$49.000

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IDEA Electronic Components Group

UK . 1,619 parts In-Stock

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Parana Technologies

USA . 1,035 parts In-Stock

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$0.034

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1,035

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ChromeModa Solutions

Germany . 692 parts In-Stock

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DigiPath Technology Company

USA . 34 parts In-Stock

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Perfect Parts

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Overview

Discover the reliability and innovation of Texas Instruments with the TPS2051BEVM, a high-quality power distribution switch for various applications. This versatile evaluation board offers short-circuit, thermal, and undervoltage protection, ensuring both safety and efficiency. Perfect for development projects and kits, this Power Management device provides a seamless experience with its 2.7V ~ 5.5V input voltage range. Trust in Texas Instruments for top-tier products that deliver exceptional performance and value to customers across all industries.

Feature Benefit Bullets

Other Names: TPS2051BEVM-ND, 296-31119

Helps in easy identification and ordering of the product.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Provides a platform for evaluating and testing the performance of the power distribution switch.

Package: Box

Ensures safe storage and transportation of the product.

Type: Power Management

Indicates the functionality of the product in managing power distribution.

Function: Power Distribution Switch (Load Switch)

Allows for controlling the distribution of power to different components, improving efficiency.

Utilized IC / Part: TPS2051B

Utilizes a specific integrated circuit for optimized performance.

Primary Attributes: 2.7V ~ 5.5V Input Voltage

Supports a wide range of input voltages, making it versatile for different applications.

Supplied Contents: Board(s)

Includes all necessary components for immediate use and testing.

Secondary Attributes: Short-Circuit, Thermal and Undervoltage Protection

Enhances the safety and reliability of the product by protecting against common issues.

Base Product Number: TPS2051

Defines the core product model for reference and compatibility.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Ensures that the product is not sensitive to moisture, making it suitable for various environments.

Technical Specifications

Additional Parts TPS2051BEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TPS2051BEVM-ND
296-31119

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Function:

Power Distribution Switch (Load Switch)

Type:

Power Management

Supplied Contents:

Board(s)

Secondary Attributes:

Short-Circuit, Thermal and Undervoltage Protection

Utilized IC / Part:

TPS2051B

Package:

Box

Embedded:

No

Primary Attributes:

2.7V ~ 5.5V Input Voltage

Base Product Number:

TPS2051

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS2051BEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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