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TPIC6E175NE

Texas Instruments

TPIC6E175NE by Texas Instruments

TPIC6E175NE by Texas Instruments is a BICMOS latch with 4 functions, 650 ns propagation delay at 5V. It features open-drain output and comes in a 20-terminal rectangular package. Ideal for applications requiring reliable signal storage and control in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,599 parts In-Stock

1+ parts

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6,599

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Digiode

USA . 1,755 parts In-Stock

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-

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1,755

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$6.980

100+ parts

-

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829

$6.980

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Parana Technologies

USA . 1,724 parts In-Stock

1+ parts

$8.107

100+ parts

-

1k+ parts

$8.696

10k+ parts

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1,724

$8.107

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$8.696

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DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$8.927

100+ parts

-

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558

$8.927

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ChromeModa Solutions

Germany . 6,698 parts In-Stock

1+ parts

$9.109

100+ parts

$7.469

1k+ parts

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10k+ parts

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6,698

$9.109

$7.469

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IDEA Electronic Components Group

UK . 2,250 parts In-Stock

1+ parts

$9.109

100+ parts

$8.654

1k+ parts

$8.198

10k+ parts

-

2,250

$9.109

$8.654

$8.198

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One Stop Electronics

USA . 797 parts In-Stock

1+ parts

$40.000

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797

$40.000

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Corphita

USA . 3,759 parts In-Stock

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3,759

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Overview

Experience the superior quality and reliability of Texas Instruments with the TPIC6E175NE. As a leading manufacturer in the industry, Texas Instruments delivers top-notch latches & flip-flops that are perfect for a variety of applications. With a nominal supply voltage of 5V and 4 functions in one package, this product offers exceptional performance and versatility. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Choose the TPIC6E175NE for unmatched value and benefits that will enhance your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 650 ns

The low propagation delay ensures fast and efficient performance, making this latch & flip-flop suitable for high-speed applications.

No. of Functions: 4

Having 4 functions in one component offers versatility and flexibility in designing circuits, making it a cost-effective solution.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this latch & flip-flop into circuit designs, ensuring space efficiency.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common standard in many electronic devices, making this latch & flip-flop compatible with a wide range of applications.

Power Supplies (V): 5

The 5V power supply requirement ensures easy integration with existing systems, reducing the need for additional power conversion components.

No. of Terminals: 20

With 20 terminals, this latch & flip-flop offers ample connectivity options for various input and output configurations, enhancing its versatility.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount and solder this latch & flip-flop onto PCBs, ensuring secure and reliable connections.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics allow for easy interfacing with other components, enhancing the overall compatibility of this latch & flip-flop.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and layout, allowing for easy integration into various electronic systems.

Technology: BICMOS

The BICMOS technology used in this latch & flip-flop combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures robust and reliable connections to the PCB, making this latch & flip-flop suitable for industrial applications.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy PCB layout and assembly, making it convenient for both prototyping and mass production.

Technical Specifications

Latches & Flip-Flops TPIC6E175NE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

650 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TPIC6E175NE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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