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TPD6E001RSFRG4

Texas Instruments

TPD6E001RSFRG4 by Texas Instruments

TPD6E001RSFRG4 by Texas Instruments is a single transient suppression device with 12 terminals. It has a max clamping voltage of 105.5V and operates b/w -40°C to 85°C. Ideal for protecting electronic circuits from voltage spikes in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 18,012 parts In-Stock

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Vyrian

USA . 4,409 parts In-Stock

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4,409

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Digiode

USA . 3,275 parts In-Stock

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3,275

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Nova Conductors

Japan . 150 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,390 parts In-Stock

1+ parts

$0.079

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-

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$1.446

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1,390

$0.079

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$1.446

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DigiPath Technology Company

USA . 2,079 parts In-Stock

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$0.087

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$0.080

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2,079

$0.087

$0.080

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ChromeModa Solutions

Germany . 1,808 parts In-Stock

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$0.089

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$0.073

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1,808

$0.089

$0.073

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IDEA Electronic Components Group

UK . 1,006 parts In-Stock

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$0.089

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$0.080

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1,006

$0.089

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$0.080

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Corohmni

South Africa . 26 parts In-Stock

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$0.187

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One Stop Electronics

USA . 1,452 parts In-Stock

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$2.010

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$2.010

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Ampacity Inc.

Singapore . 1,572 parts In-Stock

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$3.010

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$3.010

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AZTECH Wire

Italy . 776 parts In-Stock

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$7.180

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Argo Parts USA

USA . 3,525 parts In-Stock

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Corphita

USA . 1,780 parts In-Stock

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Continental Prestige Electronics

USA . 1,552 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Looking for reliable and high-quality transient suppression devices? Look no further than the TPD6E001RSFRG4 by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-of-the-line products that meet industry standards. The TPD6E001RSFRG4 is perfect for applications requiring protection against voltage transients, ensuring optimal performance and longevity of your electronic systems. Trust in Texas Instruments to provide you with the value, benefits, and advantages you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures reliable performance in various environments.

Config: SINGLE

Single configuration simplifies installation and maintenance of the device.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and enhancing efficiency.

Package Shape: SQUARE

Square shape enables easy integration into circuit designs and enhances heat dissipation.

No. of Terminals: 12

Provides ample connectivity options for versatile application possibilities.

Package Style (Meter): FLATPACK

Flatpack design offers a compact form factor for space-saving installation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability in extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables use in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance for long-term performance.

Terminal Position: QUAD

Quad terminal position enhances stability and ensures secure connections.

Minimum Breakdown Voltage: 11 V

Provides reliable protection against voltage spikes and surges.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and efficient reflow soldering processes during assembly.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering for reliable connections.

Reference Standard: IEC-61000-4-2

Compliance with this standard ensures high-quality performance and protection.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Type of diode that efficiently suppresses voltage spikes for circuit protection.

Technology: AVALANCHE

Avalanche technology provides fast response to transient voltage events for enhanced protection.

Terminal Form: NO LEAD

No lead terminal form ensures environmental friendliness and compliance with regulations.

Polarity: UNIDIRECTIONAL

Unidirectional polarity ensures consistent and reliable protection against voltage transients.

Maximum Clamping Voltage: 105.5 V

High maximum clamping voltage ensures effective protection for connected devices.

Diode Element Material: SILICON

Silicon diode element material offers high performance and reliability for transient suppression.

Technical Specifications

Transient Suppression Devices TPD6E001RSFRG4 attributes and parameters. Explore more Transient Suppression Devices devices from Texas Instruments

Specs

Minimum Breakdown Voltage:

11 V

Maximum Clamping Voltage:

105.5 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

MO-220WGGB

JESD-30 Code:

S-PQFP-N12

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Reference Standard:

IEC-61000-4-2

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TPD6E001RSFRG4 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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