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TPD4S214YFFR

Texas Instruments

TPD4S214YFFR by Texas Instruments

TPD4S214YFFR by Texas Instruments is a 12-terminal interface IC with a rectangular package shape and very thin profile. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. Ideal for applications requiring high-performance protection against ESD and surge events.

Median Price

$1.105

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,800 parts In-Stock

1+ parts

$0.642

100+ parts

$0.494

1k+ parts

$0.260

10k+ parts

-

29,800

$0.642

$0.494

$0.260

-

Arrow

USA . 500 parts In-Stock

1+ parts

$1.105

100+ parts

$0.533

1k+ parts

$0.408

10k+ parts

-

500

$1.105

$0.533

$0.408

-

DigiKey

USA . 9,654 parts In-Stock

1+ parts

$1.560

100+ parts

$0.660

1k+ parts

$0.473

10k+ parts

$0.374

9,654

$1.560

$0.660

$0.473

$0.374

Mouser Electronics

USA . 8,980 parts In-Stock

1+ parts

$1.560

100+ parts

$0.660

1k+ parts

$0.473

10k+ parts

-

8,980

$1.560

$0.660

$0.473

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.533

1k+ parts

$0.408

10k+ parts

-

500

-

$0.533

$0.408

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 78 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

-

78

$0.610

-

-

-

Vyrian

USA . 18,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,378

-

-

-

-

North Shore Components

USA . 3,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,545

-

-

-

-

Cyclops Electronics Ltd

UK . 785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

785

-

-

-

-

Prism Electronics

USA . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75

-

-

-

-

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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54

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 18,309 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

18,309

$0.550

-

-

-

Corphita

USA . 1,078 parts In-Stock

1+ parts

$0.578

100+ parts

-

1k+ parts

-

10k+ parts

-

1,078

$0.578

-

-

-

Parana Technologies

USA . 374 parts In-Stock

1+ parts

$10.214

100+ parts

-

1k+ parts

$10.748

10k+ parts

-

374

$10.214

-

$10.748

-

Corohmni

South Africa . 56 parts In-Stock

1+ parts

$10.515

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$10.515

-

-

-

DigiPath Technology Company

USA . 687 parts In-Stock

1+ parts

$11.246

100+ parts

-

1k+ parts

-

10k+ parts

-

687

$11.246

-

-

-

ChromeModa Solutions

Germany . 6,615 parts In-Stock

1+ parts

$11.476

100+ parts

$9.410

1k+ parts

-

10k+ parts

-

6,615

$11.476

$9.410

-

-

IDEA Electronic Components Group

UK . 1,065 parts In-Stock

1+ parts

$11.476

100+ parts

$10.902

1k+ parts

$10.328

10k+ parts

-

1,065

$11.476

$10.902

$10.328

-

Lixinc

USA . 14,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,556

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,107

-

-

-

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Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Continental Prestige Electronics

USA . 5,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,028

-

-

-

-

S.R.D Solutions

India . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Argo Parts USA

USA . 2,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,352

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Authorized Procurement Solutions

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6

-

-

-

-

Overview

Enhance your electronic devices with the TPD4S214YFFR by Texas Instruments, a premium quality interface IC that offers unmatched protection and reliability. Manufactured by the renowned Texas Instruments, this product is designed to cater to a variety of applications in the electronics industry. With its durable construction and innovative features, the TPD4S214YFFR ensures optimal performance and safety for your systems. Upgrade your technology with this cutting-edge solution and experience the value and benefits it brings to your projects. Choose Texas Instruments for superior quality and trusted solutions in the field of Other Function Interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for easy handling and installation.

No. of Terminals: 12

Having 12 terminals allows for multiple input and output connections, increasing the versatility of the product.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch design enables high-density mounting and efficient signal transfer.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in a wide range of climates.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/silver/copper terminal finish provides excellent conductivity and corrosion resistance for reliable performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and soldering process for ease of installation.

Width: 1.39 mm

Narrow width allows for space-efficient placement on a PCB, ideal for compact electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds minimizes heat exposure, preventing damage to sensitive components during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and joint formation for reliable connections.

Length: 1.69 mm

Compact length allows for flexibility in placement within electronic systems, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate reliably in harsh industrial environments.

Terminal Form: BALL

Ball terminal form provides secure connections and allows for easy attachment to PCB pads.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm facilitates high-density mounting and precise signal routing for enhanced performance.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit type enables seamless communication between different electrical components, enhancing system functionality.

Technical Specifications

Other Function Interface ICs TPD4S214YFFR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B12

JESD-609 Code:

e1

Length:

1.69 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.39 mm

Trade Compliance

TPD4S214YFFR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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