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TPA2018D1YZFEVM

Texas Instruments

TPA2018D1YZFEVM by Texas Instruments

TPA2018D1YZFEVM by Texas Instruments is a Class D audio amplifier evaluation board with 3W output power at 4Ohm load. Operating voltage range of 2.5V to 5.5V, it features SmartGain™ technology for efficient performance. Ideal for applications requiring mono-channel amplification in development and evaluation boards.

Median Price

$102.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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DigiKey

USA . 1 parts In-Stock

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Vyrian

USA . 7,821 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 861 parts In-Stock

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Semicontronic

India . 634 parts In-Stock

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$34.100

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$33.077

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One Stop Electronics

USA . 454 parts In-Stock

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Ampacity Inc.

Singapore . 674 parts In-Stock

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Corphita

USA . 2,662 parts In-Stock

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IDEA Electronic Components Group

UK . 2,204 parts In-Stock

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DigiPath Technology Company

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Parana Technologies

USA . 1,163 parts In-Stock

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ChromeModa Solutions

Germany . 1,007 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Overview

Upgrade your audio experience with the TPA2018D1YZFEVM by Texas Instruments. Designed with precision and reliability in mind, this Class D amplifier evaluation board from the SmartGain™ series delivers exceptional sound quality and performance. Perfect for development projects and evaluation purposes, this fully populated board offers a maximum output power of 3W at 4Ohm, ensuring crystal clear audio playback. Discover the value and benefits this product brings to your projects today!

Feature Benefit Bullets

Other Names: TPA2018D1YZFEVM-ND, 296-31090

Having multiple names ensures easier identification and compatibility with different systems.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Audio Amplifier Evaluation Boards

This product falls under multiple categories, making it versatile for various applications in development and evaluation.

Series: SmartGain™

The SmartGain™ series ensures optimized gain control for efficient amplification.

Package: Box

The box package provides protection and convenience for handling and storage.

Amplifier Type: Class D

Class D amplifiers are known for their high efficiency and low heat generation, making them ideal for compact designs.

Output Type: 1-Channel (Mono)

Mono output is suitable for applications where a single channel is required, simplifying the design and reducing complexity.

Max Output Power x Channels @ Load: 3W x 1 @ 4Ohm

With a maximum output power of 3W at 4Ohm load, this product can deliver clear and powerful audio signals.

Voltage - Supply: 2.5V ~ 5.5V

The wide supply voltage range allows flexibility in power source selection, enabling compatibility with different systems.

Board Type: Fully Populated

A fully populated board means all necessary components are already assembled, saving time and effort in set-up and testing.

Utilized IC / Part: TPA2018D1

The TPA2018D1 IC is specifically designed for audio amplification, ensuring high performance and reliability.

Supplied Contents: Board(s)

The inclusion of the board(s) provides all necessary components for evaluation and testing, facilitating quick integration into projects.

Base Product Number: TPA201

Being part of the TPA201 product line ensures compatibility with other products in the series for scalable and expandable designs.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Having a moisture sensitivity level of 1 means this product can withstand exposure to various environmental conditions without degradation.

Technical Specifications

Additional Parts TPA2018D1YZFEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TPA2018D1YZFEVM-ND
296-31090

Category:

Development Boards, Kits, Programmers
Evaluation Boards Audio Amplifier Evaluation Boards

Output Type:

1-Channel (Mono)

Max Output Power x Channels @ Load:

3W x 1 @ 4Ohm

Standard Package:

1

Series:

SmartGain™

Supplied Contents:

Board(s)

Voltage - Supply:

2.5V ~ 5.5V

Board Type:

Fully Populated

Utilized IC / Part:

TPA2018D1

Package:

Box

Amplifier Type:

Class D

Base Product Number:

TPA201

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPA2018D1YZFEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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