Loading...

TMS370C759AFNT

Texas Instruments

TMS370C759AFNT by Texas Instruments

TMS370C759AFNT by Texas Instruments is an 8-bit microcontroller with 16-bit address bus, operating at max 12 MHz. Suitable for industrial applications, it features OTPROM ROM programmability, 55 I/O lines, and ADC channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,625

-

-

-

-

Digiode

USA . 1,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

-

-

-

-

Pegasus Components GmbH

Germany . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$15.275

100+ parts

-

1k+ parts

-

10k+ parts

-

423

$15.275

-

-

-

Modulus Dynamics

Lithuania . 500 parts In-Stock

1+ parts

$18.539

100+ parts

$18.539

1k+ parts

$18.539

10k+ parts

-

500

$18.539

$18.539

$18.539

-

One Stop Electronics

USA . 668 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

668

$27.000

-

-

-

Parana Technologies

USA . 194 parts In-Stock

1+ parts

$50.087

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$50.087

-

-

-

ChromeModa Solutions

Germany . 5,667 parts In-Stock

1+ parts

$56.278

100+ parts

$46.148

1k+ parts

-

10k+ parts

-

5,667

$56.278

$46.148

-

-

IDEA Electronic Components Group

UK . 2,359 parts In-Stock

1+ parts

$56.278

100+ parts

$53.464

1k+ parts

$50.650

10k+ parts

-

2,359

$56.278

$53.464

$50.650

-

Component Stockers USA

USA . 456 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$99.990

-

-

-

Corphita

USA . 4,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,573

-

-

-

-

DigiPath Technology Company

USA . 1,065 parts In-Stock

1+ parts

-

100+ parts

$50.740

1k+ parts

-

10k+ parts

-

1,065

-

$50.740

-

-

Microchip USA

USA . 380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

380

-

-

-

-

Overview

Unlock the potential of your next project with the TMS370C759AFNT by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers a top-notch microcontroller that is versatile and reliable. From industrial applications to consumer electronics, this chip carrier package offers 55 I/O lines and PWM channels for seamless integration. Experience the benefits and value of this MICROCONTROLLER, with ROM programmability, ADC channels, and a maximum clock frequency of 12 MHz. Let Texas Instruments elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lighter and more cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage provides flexibility for various power supply configurations.

Address Bus Width: 16

Having a wider address bus width allows for larger memory addressing capabilities and more complex operations.

Package Shape: SQUARE

The square package shape makes it easier to handle and integrate into circuit designs.

Bit Size: 8

The 8-bit size allows for efficient processing of data and instructions.

Power Supplies (V): 5

The 5V power supply makes it compatible with standard power sources and reduces the need for additional voltage conversion circuits.

No. of Terminals: 68

Having more terminals allows for greater connectivity and customization in interfacing with external components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides protection to the microcontroller and allows for easy installation and removal.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage ensures reliable operation and protection against undervoltage conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions.

CPU Family: TMS370

Being part of the TMS370 family indicates compatibility with existing designs and support for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in extreme cold environments.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion for interfacing with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection in circuit board layouts.

ROM Words: 49152

The large ROM capacity allows for storing a significant amount of program data and code.

Maximum Seated Height: 4.57 mm

The low seated height makes it suitable for compact designs and tight spaces.

Width: 24.23 mm

The compact width allows for space-efficient integration into circuit layouts.

External Data Bus Width: 8

The 8-bit external data bus width enables efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 12 MHz

The high maximum clock frequency enables fast execution of instructions and processing speed.

Length: 24.23 mm

The compact length of the microcontroller makes it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures durability and stable performance in industrial settings.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller enables integration of multiple functions and features in a single chip.

RAM Bytes: 3584

The ample RAM capacity allows for temporary data storage and efficient program execution.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: J BEND

The J bend terminal form enhances connectivity and ensures secure connections in circuit layouts.

Maximum Supply Current: 55 mA

The low maximum supply current consumption helps in reducing power consumption and heat dissipation.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources for ease of integration.

PWM Channels: YES

The availability of PWM channels allows for precise control of voltage and current levels for various applications.

ROM Programmability: OTPROM

The OTPROM programmability allows for one-time programming of the ROM, enabling secure and permanent data storage.

Terminal Pitch: 1.27 mm

The small terminal pitch facilitates easy soldering and assembly onto circuit boards with fine pitch components.

Speed: 3 rpm

The 3 rpm speed specification is likely for some specific functionality or peripheral operation.

No. of I/O Lines: 55

The 55 I/O lines provide ample connectivity for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS370C759AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

No. of I/O Lines:

55

No. of Terminals:

68

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

3584

ROM Words:

49152

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

TMS370C759AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20