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TMS370C758BNMT

Texas Instruments

TMS370C758BNMT by Texas Instruments

TMS370C758BNMT by Texas Instruments is an 8-bit microcontroller with 16-bit address bus, operating at up to 20 MHz. It features 1024 bytes of RAM, OTPROM ROM programmability, and ADC channels. Widely used in industrial applications for its 5V supply voltage and -40 to 105°C temperature range.

Median Price

$28.328

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 769 parts In-Stock

1+ parts

-

100+ parts

$25.180

1k+ parts

$22.530

10k+ parts

$21.200

769

-

$25.180

$22.530

$21.200

DigiKey

USA . 769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

769

-

-

-

-

Verical

USA . 436 parts In-Stock

1+ parts

-

100+ parts

$31.475

1k+ parts

$28.163

10k+ parts

$26.500

436

-

$31.475

$28.163

$26.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,565 parts In-Stock

1+ parts

$26.572

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

$26.572

-

-

-

Vyrian

USA . 8,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,112

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,134 parts In-Stock

1+ parts

$24.558

100+ parts

-

1k+ parts

$25.224

10k+ parts

-

1,134

$24.558

-

$25.224

-

Corphita

USA . 742 parts In-Stock

1+ parts

$25.173

100+ parts

-

1k+ parts

-

10k+ parts

-

742

$25.173

-

-

-

ChromeModa Solutions

Germany . 4,144 parts In-Stock

1+ parts

$27.593

100+ parts

$22.626

1k+ parts

-

10k+ parts

-

4,144

$27.593

$22.626

-

-

IDEA Electronic Components Group

UK . 1,156 parts In-Stock

1+ parts

$27.593

100+ parts

$26.213

1k+ parts

$24.834

10k+ parts

-

1,156

$27.593

$26.213

$24.834

-

Modulus Dynamics

Lithuania . 5 parts In-Stock

1+ parts

$43.491

100+ parts

$43.491

1k+ parts

$43.491

10k+ parts

-

5

$43.491

$43.491

$43.491

-

Microchip USA

USA . 2,084 parts In-Stock

1+ parts

$66.910

100+ parts

$65.740

1k+ parts

$65.160

10k+ parts

$64.580

2,084

$66.910

$65.740

$65.160

$64.580

DigiPath Technology Company

USA . 1,762 parts In-Stock

1+ parts

-

100+ parts

$24.878

1k+ parts

-

10k+ parts

-

1,762

-

$24.878

-

-

Kepictronics

USA . 769 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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769

-

-

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Assy Fe

Spain . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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40

-

-

-

-

Overview

Discover the TMS370C758BNMT by Texas Instruments, a top-of-the-line microcontroller that offers unparalleled quality and reliability. This versatile component is suitable for a wide range of applications, providing seamless performance and efficient processing. With its innovative design and advanced technology, this product delivers exceptional value and benefits to customers, making it the perfect choice for your next project. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

Address Bus Width: 16

Enables efficient and high-speed data transfer between components in the system.

Package Shape: RECTANGULAR

Facilitates easy integration and placement of the microcontroller on a circuit board.

Bit Size: 8

Suitable for handling moderate complexity tasks and operations.

Power Supplies (V): 5

Common and easily available power supply voltage ensures compatibility in various applications.

No. of Terminals: 64

Sufficient number of terminals for connecting peripherals and components in a system.

Package Style (Meter): IN-LINE, SHRINK PITCH

Compact package style saves space on the PCB and allows for efficient layout design.

Minimum Supply Voltage: 4.5 V

Provides a range of operating voltages for flexibility and stability in different power supply conditions.

Maximum Operating Temperature: 105 °C

Wide temperature range allows the microcontroller to operate reliably in harsh environmental conditions.

CPU Family: TMS370

Part of a recognized and reliable CPU family known for performance and robustness.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low-temperature environments without performance degradation.

Terminal Finish: TIN LEAD

Provides good conductivity and corrosion resistance, ensuring reliable connections over time.

ADC Channels: YES

Integrated Analog-to-Digital Converters enable the microcontroller to interface with analog sensors and signals.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and design.

ROM Words: 32768

Ample memory space for storing program instructions and data.

Maximum Seated Height: 5.64 mm

Low-profile design allows for compact and slim device form factors.

Width: 15.24 mm

Compact width facilitates space-efficient placement on PCBs and in electronic devices.

External Data Bus Width: 8

Efficient data transfer capability for connecting to external memory or peripherals.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing and operation of the microcontroller.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges and environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller functionality for controlling system operations and functions.

RAM Bytes: 1024

Adequate RAM capacity for storing and processing data during program execution.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and stable connections on the PCB.

Maximum Supply Current: 56 mA

Reasonable current consumption for efficient power usage and thermal management.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with a wide range of electronic components and systems.

PWM Channels: YES

Integrated Pulse Width Modulation channels for precise control of digital signals and outputs.

ROM Programmability: OTPROM

One-Time Programmable ROM technology for secure and permanent storage of program code.

Terminal Pitch: 1.778 mm

Standard terminal pitch for easy soldering and assembly during PCB manufacturing.

Speed: 5 rpm

Operates at a speed suitable for most embedded system applications and tasks.

No. of I/O Lines: 53

Sufficient number of Input/Output lines for interfacing with external devices and components.

Technical Specifications

Microcontrollers TMS370C758BNMT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T64

JESD-609 Code:

e0

No. of I/O Lines:

53

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP64,.75

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

5.64 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

56 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

TMS370C758BNMT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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