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TMS370C758AFNT

Texas Instruments

TMS370C758AFNT by Texas Instruments

TMS370C758AFNT by Texas Instruments is an 8-bit microcontroller with 16-bit address bus, operating at max 20 MHz. Ideal for industrial applications, it features 1024 bytes of RAM, OTPROM ROM programmability, and ADC channels for data acquisition.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,601 parts In-Stock

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Digiode

USA . 3,895 parts In-Stock

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3,895

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Cyclops Electronics Ltd

UK . 1,695 parts In-Stock

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1,695

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Distributors (Availability)

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AZTECH Wire

Italy . 760 parts In-Stock

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$13.662

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760

$13.662

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One Stop Electronics

USA . 1,088 parts In-Stock

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$19.000

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1,088

$19.000

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Parana Technologies

USA . 757 parts In-Stock

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$23.787

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$24.415

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757

$23.787

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$24.415

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DigiPath Technology Company

USA . 946 parts In-Stock

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$26.192

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946

$26.192

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ChromeModa Solutions

Germany . 3,900 parts In-Stock

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$26.727

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$21.916

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$26.727

$21.916

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IDEA Electronic Components Group

UK . 486 parts In-Stock

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$26.727

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$25.391

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$24.054

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486

$26.727

$25.391

$24.054

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A-Z Elektronik GmbH

Germany . 4,628 parts In-Stock

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Microchip USA

USA . 2,747 parts In-Stock

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Perfect Parts

USA . 2,551 parts In-Stock

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Corphita

USA . 2,156 parts In-Stock

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Assy Fe

Spain . 18 parts In-Stock

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Overview

Unlock the power of innovation with the TMS370C758AFNT by Texas Instruments! This high-quality microcontroller offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From automotive to industrial automation, this chip is designed to deliver exceptional value and benefits to customers. Trust in Texas Instruments' renowned expertise in microcontrollers and experience the advantages of cutting-edge technology with the TMS370C758AFNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, making the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

Having a high maximum supply voltage allows for flexibility in powering the microcontroller and peripherals.

Address Bus Width: 16

A wide address bus width of 16 enables the microcontroller to access a larger memory space for processing data efficiently.

Package Shape: SQUARE

The square package shape ensures easy handling and placement during manufacturing and assembly processes.

Bit Size: 8

With an 8-bit architecture, the microcontroller is capable of handling a diverse range of computational tasks effectively.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with common power sources and components.

No. of Terminals: 68

Having a high number of terminals provides ample connectivity options for interfacing with sensors, actuators, and external devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact size and high reliability, ideal for applications with space constraints.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures stable operation and protection against voltage fluctuations.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microcontroller can withstand demanding environmental conditions.

CPU Family: TMS370

Part of the TMS370 family, known for its robust performance and reliability in embedded systems and industrial applications.

Minimum Operating Temperature: -40 °C

Operating reliably even at -40°C, the microcontroller is suitable for use in extreme cold environments.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interface with analog sensors and convert analog signals to digital data.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection with the PCB, minimizing the risk of disconnection.

ROM Words: 32768

With a ROM size of 32768 words, the microcontroller can store and retrieve program instructions efficiently.

Maximum Seated Height: 4.57 mm

A low maximum seated height makes the microcontroller suitable for slim and compact device designs.

Width: 24.23 mm

The moderate width of 24.23mm allows for easy integration and placement on the PCB without taking up too much space.

External Data Bus Width: 8

An external data bus width of 8 ensures efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 20 MHz

Operating at a maximum clock frequency of 20MHz, the microcontroller can process instructions swiftly for real-time applications.

Length: 24.23 mm

The length of 24.23mm provides a balanced form factor for easy integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the microcontroller can withstand harsh operating conditions and temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller type, it offers integrated peripherals and computational capabilities for standalone operation in embedded systems.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently store and access variable data during program execution.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance and reliability.

Terminal Form: J BEND

The J bend terminal form facilitates easy soldering and assembly onto the PCB, streamlining the manufacturing process.

Maximum Supply Current: 56 mA

Operating with a maximum supply current of 56mA ensures power efficiency and minimizes heating during operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides compatibility with standard power sources for seamless integration.

PWM Channels: YES

Support for PWM channels enables the microcontroller to generate precise analog output signals for motor control and dimming applications.

ROM Programmability: OTPROM

With OTPROM programmability, the microcontroller offers non-volatile memory for storing program instructions without the need for external memory devices.

Terminal Pitch: 1.27 mm

The tight terminal pitch of 1.27mm allows for high-density PCB designs and efficient use of space for interconnections.

Speed: 5 rpm

Operating with a speed rating of 5rpm, the microcontroller can process instructions and data at a moderate pace suitable for various applications.

No. of I/O Lines: 55

With 55 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing versatility.

Technical Specifications

Microcontrollers TMS370C758AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

No. of I/O Lines:

55

No. of Terminals:

68

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

56 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

TMS370C758AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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