Loading...

TMS370C712AFNT

Texas Instruments

TMS370C712AFNT by Texas Instruments

TMS370C712AFNT by Texas Instruments is an 8-bit microcontroller with 256 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 20 MHz, suitable for industrial applications requiring a CPU family TMS370. The chip carrier package style with J bend terminals makes it ideal for surface mount assembly in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,350

-

-

-

-

Digiode

USA . 3,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,840

-

-

-

-

Vyrian

USA . 3,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,365

-

-

-

-

Elcom Components

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$8.628

100+ parts

-

1k+ parts

-

10k+ parts

-

662

$8.628

-

-

-

One Stop Electronics

USA . 1,465 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,465

$9.000

-

-

-

Parana Technologies

USA . 295 parts In-Stock

1+ parts

$54.316

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$54.316

-

-

-

DigiPath Technology Company

USA . 662 parts In-Stock

1+ parts

$59.808

100+ parts

$55.024

1k+ parts

-

10k+ parts

-

662

$59.808

$55.024

-

-

ChromeModa Solutions

Germany . 6,799 parts In-Stock

1+ parts

$61.029

100+ parts

$50.044

1k+ parts

-

10k+ parts

-

6,799

$61.029

$50.044

-

-

IDEA Electronic Components Group

UK . 1,913 parts In-Stock

1+ parts

$61.029

100+ parts

$57.978

1k+ parts

$54.926

10k+ parts

-

1,913

$61.029

$57.978

$54.926

-

Microchip USA

USA . 2,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,525

-

-

-

-

Corphita

USA . 2,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,328

-

-

-

-

Perfect Parts

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

-

-

-

-

Overview

Upgrade your electronic devices with the TMS370C712AFNT microcontroller by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in a compact chip carrier package. This versatile microcontroller is perfect for a wide range of applications in industrial settings, offering 8-bit processing power with 22 I/O lines. With a maximum clock frequency of 20 MHz and ROM programmability, this microcontroller provides exceptional performance and flexibility. Experience the value and benefits of Texas Instruments' TMS370C712AFNT for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection to the microcontroller, making it suitable for a wide range of applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can handle higher voltage inputs, increasing its versatility for different projects.

Bit Size: 8

The 8-bit size allows for quick and efficient processing of data, making this microcontroller suitable for tasks that require moderate processing power.

Maximum Clock Frequency: 20 MHz

With a maximum clock frequency of 20 MHz, this microcontroller can perform tasks quickly and efficiently, making it ideal for time-sensitive applications.

ROM Words: 8192

With 8192 ROM words, this microcontroller has ample memory capacity to store programs and data, enabling it to handle complex tasks with ease.

RAM Bytes: 256

The 256 RAM bytes provide temporary storage for data during processing, enhancing the microcontroller's performance and efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for long-term use.

Technical Specifications

Microcontrollers TMS370C712AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e4

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

22

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

36 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Peripheral IC Type:

Trade Compliance

TMS370C712AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20