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TMS370C6C2AFNT

Texas Instruments

TMS370C6C2AFNT by Texas Instruments

TMS370C6C2AFNT by Texas Instruments is an 8-bit microcontroller with 5V supply, 20MHz clock frequency, and 128 bytes of RAM. Ideal for industrial applications, it features OTPROM ROM programmability, ADC channels, and PWM channels for versatile control systems.

Median Price

$8.350

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 610 parts In-Stock

1+ parts

-

100+ parts

$6.680

1k+ parts

$5.980

10k+ parts

$5.620

610

-

$6.680

$5.980

$5.620

DigiKey

USA . 610 parts In-Stock

1+ parts

-

100+ parts

$8.790

1k+ parts

-

10k+ parts

-

610

-

$8.790

-

-

Verical

USA . 610 parts In-Stock

1+ parts

-

100+ parts

$8.350

1k+ parts

$7.475

10k+ parts

$7.025

610

-

$8.350

$7.475

$7.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,142 parts In-Stock

1+ parts

$7.049

100+ parts

-

1k+ parts

-

10k+ parts

-

2,142

$7.049

-

-

-

Vyrian

USA . 8,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,028

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,234 parts In-Stock

1+ parts

$6.678

100+ parts

-

1k+ parts

-

10k+ parts

-

2,234

$6.678

-

-

-

Parana Technologies

USA . 2,124 parts In-Stock

1+ parts

$31.881

100+ parts

-

1k+ parts

$90.966

10k+ parts

-

2,124

$31.881

-

$90.966

-

DigiPath Technology Company

USA . 1,788 parts In-Stock

1+ parts

$35.105

100+ parts

$32.296

1k+ parts

-

10k+ parts

-

1,788

$35.105

$32.296

-

-

ChromeModa Solutions

Germany . 1,000 parts In-Stock

1+ parts

$35.821

100+ parts

$29.373

1k+ parts

-

10k+ parts

-

1,000

$35.821

$29.373

-

-

IDEA Electronic Components Group

UK . 3 parts In-Stock

1+ parts

$35.821

100+ parts

$34.030

1k+ parts

$32.239

10k+ parts

-

3

$35.821

$34.030

$32.239

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QUARKTWIN TECHNOLOGY LTD

USA . 21,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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21,562

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-

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Microchip USA

USA . 5,223 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,223

-

-

-

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Overview

Discover the power of innovation with the TMS370C6C2AFNT by Texas Instruments. As a leading manufacturer in microcontrollers, Texas Instruments delivers unparalleled quality and reliability in every product. This versatile chip carrier offers a wide range of applications, from automotive to industrial control systems. With 8192 ROM words and 128 RAM bytes, this microcontroller provides exceptional performance at a maximum clock frequency of 20 MHz. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and adds value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring product longevity and affordability.

Surface Mount: YES

Easy to assemble and mount on circuit boards, simplifying manufacturing process.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power input, accommodating various voltage sources.

Bit Size: 8

Provides processing power suitable for many applications while maintaining efficiency.

Power Supplies (V): 5

Standard voltage requirement that is commonly available, ensuring compatibility with power sources.

No. of Terminals: 28

Sufficient number of terminals for connecting to other components, enabling versatile functionality.

Package Style (Meter): CHIP CARRIER

Compact package style that saves space on circuit board, suitable for size-constrained designs.

Maximum Operating Temperature: 105 °C

Wide operating temperature range suitable for industrial applications, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Ability to withstand low temperatures, making it suitable for use in cold environments.

ROM Words: 8192

Sufficient memory capacity for storing program instructions and data, enabling complex functionality.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast processing speed, ideal for time-sensitive applications.

RAM Bytes: 128

Adequate RAM capacity for temporary data storage, supporting multitasking and data processing.

Technical Specifications

Microcontrollers TMS370C6C2AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J28

Length:

11.505 mm

No. of I/O Lines:

22

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

8192

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

36 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.505 mm

Peripheral IC Type:

Trade Compliance

TMS370C6C2AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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